Inventor
MANDAL ROBERT P
US37 patents
⚠️ This page may combine multiple inventors who share the name “MANDAL ROBERT P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
26 patentsUS6596655B1Jul 22, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC77 citations99
US6596627B2Jul 22, 2003
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC92 citations99
US6562690B1May 13, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC102 citations99
US6541367B1Apr 1, 2003
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC156 citations99
US6541282B1Apr 1, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC80 citations99
US6348725B2Feb 19, 2002
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC161 citations99
US6303523B2Oct 16, 2001
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC751 citations99
US6171945B1Jan 9, 2001
CVD nanoporous silica low dielectric constant films
APPLIED MATERIALS INC317 citations99
US6660656B2Dec 9, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC111 citations98
US6559070B1May 6, 2003
Mesoporous silica films with mobile ion gettering and accelerated processing
APPLIED MATERIALS INC107 citations98
US6734115B2May 11, 2004
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC67 citations97
US7825042B2Nov 2, 2010
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC33 citations96
US6869896B2Mar 22, 2005
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC37 citations96
US6107184AAug 22, 2000
Nano-porous copolymer films having low dielectric constants
APPLIED MATERIALS INC52 citations96
US7399697B2Jul 15, 2008
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC10 citations93
US7205224B2Apr 17, 2007
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC21 citations93
US7094710B2Aug 22, 2006
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC14 citations93
US6890639B2May 10, 2005
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC16 citations93
US6362115B1Mar 26, 2002
In-situ generation of p-xylyiene from liquid precursors
APPLIED MATERIALS INC28 citations93
US6013315AJan 11, 2000
Dispense nozzle design and dispense method
APPLIED MATERIALS INC44 citations93
US7560377B2Jul 14, 2009
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC19 citations92
US6930061B2Aug 16, 2005
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC32 citations92
US6576568B2Jun 10, 2003
Ionic additives for extreme low dielectric constant chemical formulations
APPLIED MATERIALS INC29 citations91
US6896955B2May 24, 2005
Ionic additives for extreme low dielectric constant chemical formulations
APPLIED MATERIALS INC16 citations90
US7012030B2Mar 14, 2006
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC8 citations82
US7633163B2Dec 15, 2009
Very low dielectric constant plasma-enhanced CVD films
APPLIED MATERIALS INC3 citations74
ASML HOLDING NV
4 patentsUS6770424B2Aug 3, 2004
Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
ASML HOLDING NV54 citations96
US7030039B2Apr 18, 2006
Method of uniformly coating a substrate
ASML HOLDING NV11 citations82
US6977098B2Dec 20, 2005
Method of uniformly coating a substrate
ASML HOLDING NV17 citations82
US7018943B2Mar 28, 2006
Method of uniformly coating a substrate
ASML HOLDING NV5 citations60