Inventor
LIU KUO-WEI
US11 patents
Patents
11 patentsUS6596655B1Jul 22, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC77 citations99
US6562690B1May 13, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC102 citations99
US6541282B1Apr 1, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC80 citations99
US6348725B2Feb 19, 2002
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC161 citations99
US6303523B2Oct 16, 2001
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC751 citations99
US6660656B2Dec 9, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC111 citations98
US6734115B2May 11, 2004
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC67 citations97
US6869896B2Mar 22, 2005
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC37 citations96
US7560377B2Jul 14, 2009
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC19 citations92
US6930061B2Aug 16, 2005
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC32 citations92
US6632735B2Oct 14, 2003
Method of depositing low dielectric constant carbon doped silicon oxide
APPLIED MATERIALS INC37 citations92