Inventor
KAISER BRIAN A
US3 patents
Patents
3 patentsUS5139971AAug 18, 1992
Anneal to decrease moisture absorbance of intermetal dielectrics
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US6248951B1Jun 19, 2001
Dielectric decal for a substrate of an integrated circuit package
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US6278185B1Aug 21, 2001
Semi-additive process (SAP) architecture for organic leadless grid array packages
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