Inventor
HOLLAWAY ROY D
PH17 patents
⚠️ This page may combine multiple inventors who share the name “HOLLAWAY ROY D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
16 patentsUS6545345B1Apr 8, 2003
Mounting for a package containing a chip
AMKOR TECHNOLOGY INC199 citations99
US6291884B1Sep 18, 2001
Chip-size semiconductor packages
AMKOR TECHNOLOGY INC182 citations99
US6268654B1Jul 31, 2001
Integrated circuit package having adhesive bead supporting planar lid above planar substrate
AMKOR TECHNOLOGY INC198 citations99
US6228676B1May 8, 2001
Near chip size integrated circuit package
AMKOR TECHNOLOGY INC151 citations99
US6117705ASep 12, 2000
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
AMKOR TECHNOLOGY INC202 citations99
US5981314ANov 9, 1999
Near chip size integrated circuit package
AMKOR TECHNOLOGY INC280 citations99
US6962829B2Nov 8, 2005
Method of making near chip size integrated circuit package
AMKOR TECHNOLOGY INC148 citations98
US6528869B1Mar 4, 2003
Semiconductor package with molded substrate and recessed input/output terminals
AMKOR TECHNOLOGY INC131 citations98
US6528875B1Mar 4, 2003
Vacuum sealed package for semiconductor chip
AMKOR TECHNOLOGY INC75 citations98
US6034429AMar 7, 2000
Integrated circuit package
AMKOR TECHNOLOGY INC55 citations96
US5950074ASep 7, 1999
Method of making an integrated circuit package
AMKOR TECHNOLOGY INC75 citations96
US5796163AAug 18, 1998
Solder ball joint
AMKOR TECHNOLOGY INC53 citations96
US6967395B1Nov 22, 2005
Mounting for a package containing a chip
AMKOR TECHNOLOGY INC39 citations92
US6777789B1Aug 17, 2004
Mounting for a package containing a chip
AMKOR TECHNOLOGY INC31 citations92
US6627987B1Sep 30, 2003
Ceramic semiconductor package and method for fabricating the package
AMKOR TECHNOLOGY INC35 citations92
US6532157B1Mar 11, 2003
Angulated semiconductor packages
AMKOR TECHNOLOGY INC49 citations92