Inventor
MALINOWSKI JOHN C
US13 patents
⚠️ This page may combine multiple inventors who share the name “MALINOWSKI JOHN C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS5204280AApr 20, 1993
Process for fabricating multiple pillars inside a dram trench for increased capacitor surface
IBM88 citations96
US7067914B2Jun 27, 2006
Dual chip stack method for electro-static discharge protection of integrated circuits
IBM26 citations92
US6656815B2Dec 2, 2003
Process for implanting a deep subcollector with self-aligned photo registration marks
IBM35 citations92
US7053460B2May 30, 2006
Multi-level RF passive device
IBM15 citations84
US7025891B2Apr 11, 2006
Method of polishing C4 molybdenum masks to remove molybdenum peaks
IBM13 citations80
US9230921B2Jan 5, 2016
Self-healing crack stop structure
IBM4 citations66
US9287345B2Mar 15, 2016
Semiconductor structure with thin film resistor and terminal bond pad
IBM2 citations63
US6656375B1Dec 2, 2003
Selective nitride: oxide anisotropic etch process
IBM3 citations62
COHN JOHN M
3 patentsUS8565510B2Oct 22, 2013
Methods for reading a feature pattern from a packaged die
COHN JOHN M18 citations90
US8187897B2May 29, 2012
Fabricating product chips and die with a feature pattern that contains information relating to the product chip
COHN JOHN M25 citations90
US8299609B2Oct 30, 2012
Product chips and die with a feature pattern that contains information relating to the product chip
COHN JOHN M4 citations60