Inventor
CODDING STEVEN R
US9 patents
Patents
9 patentsUS7932614B2Apr 26, 2011
Method of thinning a semiconductor substrate
IBM12 citations83
US7867876B2Jan 11, 2011
Method of thinning a semiconductor substrate
IBM7 citations83
US7387911B2Jun 17, 2008
Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
IBM10 citations80
US7025891B2Apr 11, 2006
Method of polishing C4 molybdenum masks to remove molybdenum peaks
IBM13 citations80
US7498236B2Mar 3, 2009
Silicon wafer thinning end point method
IBM3 citations62
US7348216B2Mar 25, 2008
Rework process for removing residual UV adhesive from C4 wafer surfaces
IBM3 citations58
US7572739B2Aug 11, 2009
Tape removal in semiconductor structure fabrication
IBM2 citations57
US8034718B2Oct 11, 2011
Method to recover patterned semiconductor wafers for rework
IBM0 citations44
US7666689B2Feb 23, 2010
Method to remove circuit patterns from a wafer
IBM0 citations42