Inventor

REID JONATHAN D

US60 patents

⚠️ This page may combine multiple inventors who share the name “REID JONATHAN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

REID JONATHAN D

NOVELLUS SYSTEMS INC

Copper electroplating apparatus

Method of electroplating using a high resistance ionic current source

High resistance ionic current source

Copper electroplating method and apparatus

Electroplating process for avoiding defects in metal features of integrated circuit devices

Methods and apparatus for controlled-angle wafer immersion

Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer

Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer

Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability

Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer

Method for planar electroplating

Clamshell apparatus for electrochemically treating wafers

Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources

Clamshell apparatus with dynamic uniformity control

Capping before barrier-removal IC fabrication method

Electroplating process including pre-wetting and rinsing

Process for through silicon via filing

Electroless copper deposition method for preparing copper seed layers

Anode and anode chamber for copper electroplating

Capping before barrier-removal IC fabrication method

Capping before barrier-removal IC fabrication method

Methods and apparatus for controlled-angle wafer positioning

Methods for the electrochemical deposition of copper onto a barrier layer of a work piece

Methods and apparatus for controlled-angle wafer positioning

Clamshell apparatus with crystal shielding and in-situ rinse-dry

Electroplating process chamber and method with pre-wetting and rinsing capability

Sonic irradiation during wafer immersion

Electroplating bath containing wetting agent for defect reduction

Anneal of ruthenium seed layer to improve copper plating

Electroplating using DC current interruption and variable rotation rate

Electroless layer plating process and apparatus

Dynamic current distribution control apparatus and method for wafer electroplating

Dynamic current distribution control apparatus and method for wafer electroplating

IBM

Au-Sn transient liquid bonding in high performance laminates

Method for fabricating metal core layers for a multi-layer circuit board

Direct electroplating of through holes

Au-Sn transient liquid bonding in high performance laminates

REID JONATHAN D

Capping before barrier-removal IC fabrication method

Process for through silicon via filling

Method and apparatus for filling interconnect structures

MAYER STEVEN T

Method of electroplating using a high resistance ionic current source

Semiconductive counter electrode for electrolytic current distribution control

PONNUSWAMY THOMAS A

Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers

Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers

LAM RES CORP

Control of electrolyte flow dynamics for uniform electroplating

Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer

PRABHAKAR VINAY

Wafer electroplating apparatus for reducing edge defects

WEBB ERIC

Deposit morphology of electroplated copper

ZHOU JIAN

Copper electroplating solutions with halides

PORTER DAVID W

Dynamic current distribution control apparatus and method for wafer electroplating