Inventor
PATTON EVAN E
US31 patents
⚠️ This page may combine multiple inventors who share the name “PATTON EVAN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
28 patentsUS6527920B1Mar 4, 2003
Copper electroplating apparatus
NOVELLUS SYSTEMS INC251 citations99
US6964792B1Nov 15, 2005
Methods and apparatus for controlling electrolyte flow for uniform plating
NOVELLUS SYSTEMS INC121 citations98
US6890416B1May 10, 2005
Copper electroplating method and apparatus
NOVELLUS SYSTEMS INC92 citations98
US6551487B1Apr 22, 2003
Methods and apparatus for controlled-angle wafer immersion
NOVELLUS SYSTEMS INC145 citations98
US6162344ADec 19, 2000
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
NOVELLUS SYSTEMS INC179 citations98
US6156167ADec 5, 2000
Clamshell apparatus for electrochemically treating semiconductor wafers
NOVELLUS SYSTEMS INC325 citations98
US6139712AOct 31, 2000
Method of depositing metal layer
NOVELLUS SYSTEMS INC198 citations98
US6110346AAug 29, 2000
Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer
NOVELLUS SYSTEMS INC158 citations98
US6099702AAug 8, 2000
Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
NOVELLUS SYSTEMS INC203 citations98
US6074544AJun 13, 2000
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
NOVELLUS SYSTEMS INC288 citations98
US6800187B1Oct 5, 2004
Clamshell apparatus for electrochemically treating wafers
NOVELLUS SYSTEMS INC168 citations97
US6773571B1Aug 10, 2004
Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources
NOVELLUS SYSTEMS INC144 citations97
US6755946B1Jun 29, 2004
Clamshell apparatus with dynamic uniformity control
NOVELLUS SYSTEMS INC79 citations97
US6214193B1Apr 10, 2001
Electroplating process including pre-wetting and rinsing
NOVELLUS SYSTEMS INC48 citations96
US6946065B1Sep 20, 2005
Process for electroplating metal into microscopic recessed features
NOVELLUS SYSTEMS INC60 citations95
US6589401B1Jul 8, 2003
Apparatus for electroplating copper onto semiconductor wafer
NOVELLUS SYSTEMS INC67 citations95
US6436249B1Aug 20, 2002
Clamshell apparatus for electrochemically treating semiconductor wafers
NOVELLUS SYSTEMS INC69 citations95
US7189647B2Mar 13, 2007
Sequential station tool for wet processing of semiconductor wafers
NOVELLUS SYSTEMS INC41 citations94
US7686927B1Mar 30, 2010
Methods and apparatus for controlled-angle wafer positioning
NOVELLUS SYSTEMS INC26 citations92
US7097410B1Aug 29, 2006
Methods and apparatus for controlled-angle wafer positioning
NOVELLUS SYSTEMS INC28 citations92
US7033465B1Apr 25, 2006
Clamshell apparatus with crystal shielding and in-situ rinse-dry
NOVELLUS SYSTEMS INC48 citations92
US6716334B1Apr 6, 2004
Electroplating process chamber and method with pre-wetting and rinsing capability
NOVELLUS SYSTEMS INC30 citations92
US6343793B1Feb 5, 2002
Dual channel rotary union
NOVELLUS SYSTEMS INC19 citations92
US8048280B2Nov 1, 2011
Process for electroplating metals into microscopic recessed features
NOVELLUS SYSTEMS INC24 citations91
US7084466B1Aug 1, 2006
Liquid detection end effector sensor and method of using the same
NOVELLUS SYSTEMS INC14 citations84
US7696538B2Apr 13, 2010
Sensor for measuring liquid contaminants in a semiconductor wafer fabrication process
NOVELLUS SYSTEMS INC3 citations63
US8883640B1Nov 11, 2014
Sequential station tool for wet processing of semiconductor wafers
NOVELLUS SYSTEMS INC3 citations60
US8026174B1Sep 27, 2011
Sequential station tool for wet processing of semiconductor wafers
NOVELLUS SYSTEMS INC3 citations60