Inventor
DIVAKARUNI RAMA
US53 patents
⚠️ This page may combine multiple inventors who share the name “DIVAKARUNI RAMA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
45 patentsUS6864540B1Mar 8, 2005
High performance FET with elevated source/drain region
IBM130 citations99
US6472258B1Oct 29, 2002
Double gate trench transistor
IBM162 citations99
US6429477B1Aug 6, 2002
Shared body and diffusion contact structure and method for fabricating same
IBM228 citations99
US7030481B2Apr 18, 2006
High density chip carrier with integrated passive devices
IBM401 citations98
US6962872B2Nov 8, 2005
High density chip carrier with integrated passive devices
IBM363 citations98
US6501131B1Dec 31, 2002
Transistors having independently adjustable parameters
IBM95 citations98
US6498061B2Dec 24, 2002
Negative ion implant mask formation for self-aligned, sublithographic resolution patterning for single-sided vertical device formation
IBM66 citations96
US9685535B1Jun 20, 2017
Conductive contacts in semiconductor on insulator substrate
IBM15 citations93
US7265417B2Sep 4, 2007
Method of fabricating semiconductor side wall fin
IBM20 citations93
US6998666B2Feb 14, 2006
Nitrided STI liner oxide for reduced corner device impact on vertical device performance
IBM46 citations93
US6940149B1Sep 6, 2005
Structure and method of forming a bipolar transistor having a void between emitter and extrinsic base
IBM64 citations93
US6806138B1Oct 19, 2004
Integration scheme for enhancing capacitance of trench capacitors
IBM31 citations93
US6566228B1May 20, 2003
Trench isolation processes using polysilicon-assisted fill
IBM40 citations93
US6441423B1Aug 27, 2002
Trench capacitor with an intrinsically balanced field across the dielectric
IBM31 citations93
US6373086B1Apr 16, 2002
Notched collar isolation for suppression of vertical parasitic MOSFET and the method of preparing the same
IBM30 citations93
US6288422B1Sep 11, 2001
Structure and process for fabricating a 6F2 DRAM cell having vertical MOSFET and large trench capacitance
IBM26 citations93
US6281539B1Aug 28, 2001
Structure and process for 6F2 DT cell having vertical MOSFET and large storage capacitance
IBM31 citations93
US6746933B1Jun 8, 2004
Pitcher-shaped active area for field effect transistor and method of forming same
IBM35 citations92
US6509624B1Jan 21, 2003
Semiconductor fuses and antifuses in vertical DRAMS
IBM37 citations92
US6340615B1Jan 22, 2002
Method of forming a trench capacitor DRAM cell
IBM21 citations92
US6184107B1Feb 6, 2001
Capacitor trench-top dielectric for self-aligned device isolation
IBM37 citations92
US7190046B2Mar 13, 2007
Bipolar transistor having reduced collector-base capacitance
IBM19 citations91
US6869860B2Mar 22, 2005
Filling high aspect ratio isolation structures with polysilazane based material
IBM35 citations90
US6605838B1Aug 12, 2003
Process flow for thick isolation collar with reduced length
IBM39 citations90
US7615457B2Nov 10, 2009
Method of fabricating self-aligned bipolar transistor having tapered collector
IBM9 citations84
US7425754B2Sep 16, 2008
Structure and method of self-aligned bipolar transistor having tapered collector
IBM13 citations84
US7170126B2Jan 30, 2007
Structure of vertical strained silicon devices
IBM16 citations84
US6821857B1Nov 23, 2004
High on-current device for high performance embedded DRAM (eDRAM) and method of forming the same
IBM14 citations84
US6809368B2Oct 26, 2004
TTO nitride liner for improved collar protection and TTO reliability
IBM15 citations84
US6620676B2Sep 16, 2003
Structure and methods for process integration in vertical DRAM cell fabrication
IBM14 citations84
US6404000B1Jun 11, 2002
Pedestal collar structure for higher charge retention time in trench-type DRAM cells
IBM17 citations84
US7462547B2Dec 9, 2008
Method of fabricating a bipolar transistor having reduced collector-base capacitance
IBM12 citations83
US7566599B2Jul 28, 2009
High performance FET with elevated source/drain region
IBM5 citations74
US7361556B2Apr 22, 2008
Method of fabricating semiconductor side wall fin
IBM5 citations74
US7163864B1Jan 16, 2007
Method of fabricating semiconductor side wall fin
IBM7 citations74
US6964892B2Nov 15, 2005
N-channel metal oxide semiconductor (NMOS) driver circuit and method of making same
IBM10 citations74
US6790739B2Sep 14, 2004
Structure and methods for process integration in vertical DRAM cell fabrication
IBM11 citations74
US6433397B1Aug 13, 2002
N-channel metal oxide semiconductor (NMOS) driver circuit and method of making same
IBM7 citations74
US6960514B2Nov 1, 2005
Pitcher-shaped active area for field effect transistor and method of forming same
IBM9 citations73
US6724053B1Apr 20, 2004
PMOSFET device with localized nitrogen sidewall implantation
IBM12 citations73
US6348394B1Feb 19, 2002
Method and device for array threshold voltage control by trapped charge in trench isolation
IBM7 citations73
US6197632B1Mar 6, 2001
Method for dual sidewall oxidation in high density, high performance DRAMS
IBM14 citations73
US6967137B2Nov 22, 2005
Forming collar structures in deep trench capacitors with thermally stable filler material
IBM3 citations63
US6245651B1Jun 12, 2001
Method of simultaneously forming a line interconnect and a borderless contact to diffusion
IBM5 citations63
US6890815B2May 10, 2005
Reduced cap layer erosion for borderless contacts
IBM5 citations61
INFINEON TECHNOLOGIES CORP
2 patentsINFINEON TECHNOLOGIES AG
1 patentEPLIS TECH INC
1 patentELPIS TECH INC
1 patentShowing the top 50 of 53 patents by PatentIndex Score.