Inventor
KAI KENYA
JP6 patents
Patents
6 patentsUS9613795B2Apr 4, 2017
Wafer processing method to remove crystal strains
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US12183635B2Dec 31, 2024
Wafer processing method and wafer processing apparatus
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US11515210B2Nov 29, 2022
Wafer processing method and wafer processing apparatus
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US11165408B2Nov 2, 2021
Method of manufacturing substrate for acoustic wave device
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US11894823B2Feb 6, 2024
Saw device manufacturing method
DISCO CORP0 citations46
US9731402B2Aug 15, 2017
Grinding apparatus
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