Inventor
CHING KAI-MING
TW45 patents
⚠️ This page may combine multiple inventors who share the name “CHING KAI-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
30 patentsUS7564115B2Jul 21, 2009
Tapered through-silicon via structure
TAIWAN SEMICONDUCTOR MFG155 citations99
US7973413B2Jul 5, 2011
Through-substrate via for semiconductor device
TAIWAN SEMICONDUCTOR MFG132 citations98
US7843064B2Nov 30, 2010
Structure and process for the formation of TSVs
TAIWAN SEMICONDUCTOR MFG75 citations97
US6743660B2Jun 1, 2004
Method of making a wafer level chip scale package
TAIWAN SEMICONDUCTOR MFG110 citations97
US7816227B2Oct 19, 2010
Tapered through-silicon via structure
TAIWAN SEMICONDUCTOR MFG45 citations96
US6756294B1Jun 29, 2004
Method for improving bump reliability for flip chip devices
TAIWAN SEMICONDUCTOR MFG53 citations96
US8034708B2Oct 11, 2011
Structure and process for the formation of TSVs
TAIWAN SEMICONDUCTOR MFG13 citations93
US7514797B2Apr 7, 2009
Multi-die wafer level packaging
TAIWAN SEMICONDUCTOR MFG22 citations93
US6636313B2Oct 21, 2003
Method of measuring photoresist and bump misalignment
TAIWAN SEMICONDUCTOR MFG37 citations92
US6602775B1Aug 5, 2003
Method to improve reliability for flip-chip device for limiting pad design
TAIWAN SEMICONDUCTOR MFG29 citations92
US6696356B2Feb 24, 2004
Method of making a bump on a substrate without ribbon residue
TAIWAN SEMICONDUCTOR MFG23 citations89
US9355933B2May 31, 2016
Cooling channels in 3DIC stacks
TAIWAN SEMICONDUCTOR MFG9 citations84
US6974659B2Dec 13, 2005
Method of forming a solder ball using a thermally stable resinous protective layer
TAIWAN SEMICONDUCTOR MFG15 citations84
US7557423B2Jul 7, 2009
Semiconductor structure with a discontinuous material density for reducing eddy currents
TAIWAN SEMICONDUCTOR MFG8 citations83
US6715524B2Apr 6, 2004
DFR laminating and film removing system
TAIWAN SEMICONDUCTOR MFG16 citations82
US8005326B2Aug 23, 2011
Optical clock signal distribution using through-silicon vias
TAIWAN SEMICONDUCTOR MFG5 citations74
US6623912B1Sep 23, 2003
Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist
TAIWAN SEMICONDUCTOR MFG7 citations74
US7276454B2Oct 2, 2007
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
TAIWAN SEMICONDUCTOR MFG5 citations73
US7134199B2Nov 14, 2006
Fluxless bumping process
TAIWAN SEMICONDUCTOR MFG10 citations73
US6926818B1Aug 9, 2005
Method to enhance the adhesion between dry film and seed metal
TAIWAN SEMICONDUCTOR MFG7 citations73
US6638688B2Oct 28, 2003
Selective electroplating method employing annular edge ring cathode electrode contact
TAIWAN SEMICONDUCTOR MFG9 citations70
US9236359B2Jan 12, 2016
System and method for 3D integrated circuit stacking
TAIWAN SEMICONDUCTOR MFG1 citations63
US9006892B2Apr 14, 2015
System and method for 3D integrated circuit stacking
TAIWAN SEMICONDUCTOR MFG1 citations63
US7785927B2Aug 31, 2010
Multi-die wafer level packaging
TAIWAN SEMICONDUCTOR MFG2 citations63
US7666688B2Feb 23, 2010
Method of manufacturing a coil inductor
TAIWAN SEMICONDUCTOR MFG4 citations63
US7906425B2Mar 15, 2011
Fluxless bumping process
TAIWAN SEMICONDUCTOR MFG4 citations62
US7888236B2Feb 15, 2011
Semiconductor device and fabrication methods thereof
TAIWAN SEMICONDUCTOR MFG3 citations62
US7468321B2Dec 23, 2008
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
TAIWAN SEMICONDUCTOR MFG4 citations62
US6797075B2Sep 28, 2004
Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication
TAIWAN SEMICONDUCTOR MFG5 citations61
US6802250B2Oct 12, 2004
Stencil design for solder paste printing
TAIWAN SEMICONDUCTOR MFG1 citations52
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS12021042B2Jun 25, 2024
Semiconductor package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11637072B2Apr 25, 2023
Semiconductor package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US9859252B2Jan 2, 2018
Cooling channels in 3DIC stacks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9673174B2Jun 6, 2017
Through silicon via bonding structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52