Inventor

SAWAMURA ICHIROH

JP3 patents

⚠️ This page may combine multiple inventors who share the name “SAWAMURA ICHIROH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JAPAN ENERGY CORP

1 patent

US5693203ADec 2, 1997

Sputtering target assembly having solid-phase bonded interface

JAPAN ENERGY CORP219 citations95

NIPPON MINING CO

1 patent

US7138040B2Nov 21, 2006

Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode

NIPPON MINING CO12 citations82

NIPPON KOKAN KK

1 patent

US4675055AJun 23, 1987

Method of producing Ti alloy plates

NIPPON KOKAN KK14 citations69