P

Inventor

WANG KUANG-CHIH

TW10 patents
⚠️ This page may combine multiple inventors who share the name “WANG KUANG-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

6 patents
US7449407B2Nov 11, 2008

Air gap for dual damascene applications

UNITED MICROELECTRONICS CORP59 citations98
US7253095B2Aug 7, 2007

Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device

UNITED MICROELECTRONICS CORP59 citations98
US7138329B2Nov 21, 2006

Air gap for tungsten/aluminum plug applications

UNITED MICROELECTRONICS CORP74 citations98
US6743721B2Jun 1, 2004

Method and system for making cobalt silicide

UNITED MICROELECTRONICS CORP29 citations92
US6943110B1Sep 13, 2005

Wafer processing apparatus and methods for depositing cobalt silicide

UNITED MICROELECTRONICS CORP10 citations74
US6878627B1Apr 12, 2005

Semiconductor device with cobalt silicide contacts and method of making the same

UNITED MICROELECTRONICS CORP6 citations74

UNITED INTEGRATED CIRCUITS CORP

2 patents
US6174813B1Jan 16, 2001

Dual damascene manufacturing process

UNITED INTEGRATED CIRCUITS CORP21 citations91
US6066550AMay 23, 2000

Method of improving selectivity between silicon nitride and silicon oxide

UNITED INTEGRATED CIRCUITS CORP24 citations91

UNITED MICORELECTRONICS CORP

1 patent
US6917109B2Jul 12, 2005

Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device

UNITED MICORELECTRONICS CORP61 citations94

WINBOND ELECTRONICS CORP

1 patent
US5604155AFeb 18, 1997

Al-based contact formation process using Ti glue layer to prevent nodule-induced bridging

WINBOND ELECTRONICS CORP35 citations92