Inventor

SAUCIUC IOAN

US51 patents

⚠️ This page may combine multiple inventors who share the name “SAUCIUC IOAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAUCIUC IOAN

INTEL CORP

Microelectronic cooling apparatus and associated method

Piezo fans for cooling an electronic device

Rake shaped fan

Electronic thermal management

Phase-change refrigeration apparatus with thermoelectric cooling element and methods

Liquid metal thermal interface for an integrated circuit device

Method and apparatus for removing heat

Cooling integrated circuits using a cold plate with two phase thin film evaporation

Apparatus and method for cooling integrated circuit devices

Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same

Tunnel-phase change heat exchanger

Heat exchanger retention mechanism

Electrically conductive fluid interconnects for integrated circuit devices

Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls

Computer system having controlled cooling

Integrated circuit coolant microchannel assembly with targeted channel configuration

Heat pipe having an inner retaining wall for wicking components

Wireless device enclosure using piezoelectric cooling structures

Cooling solutions for die-down integrated circuit packages

Cooling arrangement to cool components on circuit board

Method and system to cool memory

Integrated circuit coolant microchannel with compliant cover

Heat sink and electronic circuit module including the same

Heat sink with thermoelectric module

Heatsink, method of manufacturing same, and microelectronic package containing same

Electromagnetically-actuated micropump for liquid metal alloy

Dual direction rake piezo actuator

Application and removal of thermal interface material

Heatsink device and method

Clearing of vapor lock in a microchannel cooling subsystem

Low profile heat spreader and methods

Piezoelectric air jet augmented cooling for electronic devices

Loading mechanisms for integrated circuit (IC) packages

Method and apparatus for dissipating heat from an electronic device

Heat dissipating device with enhanced boiling/condensation structure

Heat dissipating device with enhanced boiling/condensation structure

Method and apparatus for dissipating heat from an electronic device

Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

Piezo actuator for cooling

High performance transient uniform cooling solution for thermal compression bonding process

Localized microelectronic cooling apparatuses and associated methods and systems

Multi-layer piezoelectric actuators with conductive polymer electrodes

Flow solutions for microelectronic cooling

Compact rake piezoelectric assembly and method of manufacturing same

SAUCIUC IOAN

Direct air impingement cooling of package structures

Method and apparatus for two-phase start-up operation

HOOD III CHARLES D

Hybrid heat exchanger

SCHROEDER CHRISTOPHER R

Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

LI ZHIHUA

High performance transient uniform cooling solution for thermal compression bonding process

DELL PRODUCTS LP

Hybrid heat exchanger