Inventor
CHRYSLER GREGORY M
US100 patents
⚠️ This page may combine multiple inventors who share the name “CHRYSLER GREGORY M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
29 patentsUS6992382B2Jan 31, 2006
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
INTEL CORP122 citations99
US7795711B2Sep 14, 2010
Microelectronic cooling apparatus and associated method
INTEL CORP80 citations98
US7031155B2Apr 18, 2006
Electronic thermal management
INTEL CORP119 citations98
US6845622B2Jan 25, 2005
Phase-change refrigeration apparatus with thermoelectric cooling element and methods
INTEL CORP92 citations98
US6706562B2Mar 16, 2004
Electronic assembly with high capacity thermal spreader and methods of manufacture
INTEL CORP71 citations98
US6650542B1Nov 18, 2003
Piezoelectric actuated jet impingement cooling
INTEL CORP116 citations98
US6653730B2Nov 25, 2003
Electronic assembly with high capacity thermal interface
INTEL CORP83 citations97
US7348665B2Mar 25, 2008
Liquid metal thermal interface for an integrated circuit device
INTEL CORP54 citations96
US6981380B2Jan 3, 2006
Thermoelectric cooling for microelectronic packages and dice
INTEL CORP51 citations96
US6785134B2Aug 31, 2004
Embedded liquid pump and microchannel cooling system
INTEL CORP54 citations96
US6646874B2Nov 11, 2003
Mobile computer system with detachable thermoelectric module for enhanced cooling capability in a docking station
INTEL CORP64 citations96
US7336487B1Feb 26, 2008
Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant
INTEL CORP50 citations95
US6661660B2Dec 9, 2003
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
INTEL CORP72 citations95
US6639799B2Oct 28, 2003
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
INTEL CORP67 citations95
US7550901B2Jun 23, 2009
Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same
INTEL CORP21 citations93
US7435623B2Oct 14, 2008
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
INTEL CORP38 citations93
US7012011B2Mar 14, 2006
Wafer-level diamond spreader
INTEL CORP23 citations93
US6795311B2Sep 21, 2004
Method and apparatus for cooling portable computers
INTEL CORP21 citations93
US6609561B2Aug 26, 2003
Tunnel-phase change heat exchanger
INTEL CORP29 citations93
US6549407B1Apr 15, 2003
Heat exchanger retention mechanism
INTEL CORP40 citations93
US7851905B2Dec 14, 2010
Microelectronic package and method of cooling an interconnect feature in same
INTEL CORP40 citations92
US7508671B2Mar 24, 2009
Computer system having controlled cooling
INTEL CORP28 citations92
US7362580B2Apr 22, 2008
Electronic assembly having an indium wetting layer on a thermally conductive body
INTEL CORP41 citations92
US7259965B2Aug 21, 2007
Integrated circuit coolant microchannel assembly with targeted channel configuration
INTEL CORP40 citations92
US7218519B2May 15, 2007
Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels
INTEL CORP24 citations92
US7063268B2Jun 20, 2006
Electro-active fluid cooling system
INTEL CORP26 citations92
US6770966B2Aug 3, 2004
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
INTEL CORP21 citations92
US7457116B2Nov 25, 2008
Method and system to cool memory
INTEL CORP9 citations84
US7449780B2Nov 11, 2008
Apparatus to minimize thermal impedance using copper on die backside
INTEL CORP11 citations84
IBM
20 patentsUS6213194B1Apr 10, 2001
Hybrid cooling system for electronics module
IBM152 citations99
US6034872AMar 7, 2000
Cooling computer systems
IBM162 citations99
US6205796B1Mar 27, 2001
Sub-dew point cooling of electronic systems
IBM107 citations98
US5963425AOct 5, 1999
Combined air and refrigeration cooling for computer systems
IBM111 citations98
US5953930ASep 21, 1999
Evaporator for use in an extended air cooling system for electronic components
IBM104 citations98
US5896922AApr 27, 1999
Cold plate for dual refrigeration systems
IBM102 citations98
US5456081AOct 10, 1995
Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability
IBM146 citations98
US5970731AOct 26, 1999
Modular refrigeration system
IBM110 citations97
US5370178ADec 6, 1994
Convertible cooling module for air or water cooling of electronic circuit components
IBM130 citations97
US5303555AApr 19, 1994
Electronics package with improved thermal management by thermoacoustic heat pumping
IBM132 citations97
US4765397AAug 23, 1988
Immersion cooled circuit module with improved fins
IBM208 citations97
US6223810B1May 1, 2001
Extended air cooling with heat loop for dense or compact configurations of electronic components
IBM64 citations96
US6035655AMar 14, 2000
Modular refrigeration system
IBM69 citations96
US5954127ASep 21, 1999
Cold plate for dual refrigeration system
IBM77 citations96
US5934364AAug 10, 1999
Cold plate for dual refrigeration systems
IBM48 citations96
US5482113AJan 9, 1996
Convertible heat exchanger for air or water cooling of electronic circuit components and the like
IBM80 citations96
US5615084AMar 25, 1997
Enhanced flow distributor for integrated circuit spot coolers
IBM26 citations92
US5609202AMar 11, 1997
Enhanced flow distributor for integrated circuit spot coolers
IBM23 citations92
US5412536AMay 2, 1995
Local condensation control for liquid impingement two-phase cooling
IBM44 citations92
US5604665AFeb 18, 1997
Multiple parallel impingement flow cooling with tuning
IBM54 citations91
CHRYSLER GREGORY M
1 patentShowing the top 50 of 100 patents by PatentIndex Score.