Inventor

IHARA YOSHIHIRO

JP23 patents

⚠️ This page may combine multiple inventors who share the name “IHARA YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IHARA YOSHIHIRO

SHINKO ELECTRIC IND CO

Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device

Method of forming bumps by electroplating

Device for forming bumps by metal plating

Film capacitor and semiconductor package or device carrying same

Semiconductor device and semiconductor device array

Circuit board module

Board with connection terminals

Semiconductor device and manufacturing method therefor

Bioelectrode component

Semiconductor device, heat conductor, and method for manufacturing semiconductor device

Semiconductor device

Battery and method for producing the same

Folded substrate for stacked integrated circuit devices

Semiconductor device including semiconductor chips stacked via relay substrate

IHARA YOSHIHIRO

Board having connection terminal

Socket and semiconductor device provided with socket

Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure

Socket having two relay boards and a frame for holding a terminal to connect an electronic device to a mounting board

Connection terminal structure, method for manufacturing connection terminal structure, and connection terminal structure substrate

Socket

Substrate having leads

HORIKAWA YASUYOSHI

Socket and method of fabricating the same

NIHON KOHDEN CORP

Sensor including a peelable insulation sheet