Inventor

MANALAC RODEL

SG3 patents

⚠️ This page may combine multiple inventors who share the name “MANALAC RODEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED TEST AND ASSEMBLY TEST

1 patent

US7109570B2Sep 19, 2006

Integrated circuit package with leadframe enhancement and method of manufacturing the same

UNITED TEST AND ASSEMBLY TEST12 citations71

CASTILLO DENVER PAUL C

1 patent

US8592258B2Nov 26, 2013

Semiconductor package and method of attaching semiconductor dies to substrates

CASTILLO DENVER PAUL C0 citations31

KOH YONG CHUAN

1 patent

US8247272B2Aug 21, 2012

Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process

KOH YONG CHUAN0 citations20