Inventor
JEONG JAMES Y
US4 patents
Patents
4 patentsUS9716066B2Jul 25, 2017
Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias
INTEL CORP16 citations77
US9748180B2Aug 29, 2017
Through-body via liner deposition
INTEL CORP5 citations66
US12051623B2Jul 30, 2024
Enhanced grating aligned patterning for EUV direct print processes
INTEL CORP0 citations53
US12368095B2Jul 22, 2025
Simultaneous filling of variable aspect ratio single damascene contact to gate and trench vias with low resistance barrierless selective metallization
INTEL CORP0 citations50