Inventor

CHUNG JI YOUNG

KR56 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG JI YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG JI YOUNG

AMKOR TECHNOLOGY INC

Wafer level stacked package

Fingerprint sensor and manufacturing method thereof

Stacked semiconductor package and method of making same

Semiconductor package with patterning layer and method of making same

Solder attach film and method of forming solder ball using the same

Fingerprint sensor and manufacturing method thereof

Stacked semiconductor package and method of making same

Land structure for semiconductor package and method therefor

Semiconductor device with redistribution layers formed utilizing dummy substrates

Fingerprint sensor and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Packaged electronic device having reduced parasitic effects and method

Method of manufacturing an electronic device and electronic device manufactured thereby

Semiconductor device and method of manufacturing semiconductor device

Electronic package structure having insulated substrate with lands and conductive patterns

Land structure for semiconductor package and method therefor

Semiconductor package and fabricating method thereof

Method of forming a molded substrate electronic package and structure

Semiconductor device

Semiconductor package and method therefor

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Semiconductor device and manufacturing method thereof

Semiconductor package and method therefor

Solder attach film and assembly

Sensor package and manufacturing method thereof

AMKOR TECH SINGAPORE HOLDING PTE LTD

Semiconductor device with redistribution layers formed utilizing dummy substrates

Semiconductor device with redistribution layers formed utilizing dummy substrates

Land structure for semiconductor package and method therefor

Fingerprint sensor and manufacturing method thereof

Sensor package and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Method of forming a molded substrate electronic package and structure

Land structure for semiconductor package and method therefor

Sensor package and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Sensor package and manufacturing method thereof

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Semiconductor device and manufacturing method thereof

Method of manufacturing an electronic device and electronic device manufactured thereby

Method of manufacturing an electronic device and electronic device manufactured thereby

Electronic sensor devices and methods of manufacturing electronic sensor devices

Semiconductor devices and methods of manufacturing semiconductor devices

Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices

Semiconductor devices and methods of manufacturing semiconductor devices

CHUNG JI YOUNG

Mandibular advancement device for anti snoring

CHUNG JI-YOUNG

Snoring prevention device

KIM DO HYEONG

Semiconductor package with patterning layer and method of making same