Inventor
CHUNG MYUNG-KEE
KR14 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG MYUNG-KEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS7064435B2Jun 20, 2006
Semiconductor package with improved ball land structure
SAMSUNG ELECTRONICS CO LTD109 citations96
US6041495AMar 28, 2000
Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same
SAMSUNG ELECTRONICS CO LTD82 citations94
US6207478B1Mar 27, 2001
Method for manufacturing semiconductor package of center pad type device
SAMSUNG ELECTRONICS CO LTD24 citations89
US6348363B1Feb 19, 2002
Method for manufacturing a semiconductor package
SAMSUNG ELECTRONICS CO LTD32 citations88
US7588964B2Sep 15, 2009
Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same
SAMSUNG ELECTRONICS CO LTD18 citations84
US7807507B2Oct 5, 2010
Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package
SAMSUNG ELECTRONICS CO LTD8 citations83
US6245490B1Jun 12, 2001
Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same
SAMSUNG ELECTRONICS CO LTD15 citations82
US10872802B2Dec 22, 2020
Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12237309B2Feb 25, 2025
Semiconductor package having pads with stepped structure
SAMSUNG ELECTRONICS CO LTD0 citations59
US11955464B2Apr 9, 2024
Semiconductor package having pads with stepped structure
SAMSUNG ELECTRONICS CO LTD0 citations59
US11574892B2Feb 7, 2023
Semiconductor package having pads with stepped structure
SAMSUNG ELECTRONICS CO LTD0 citations59