Inventor
GRACIAS DAVID H
US30 patents
⚠️ This page may combine multiple inventors who share the name “GRACIAS DAVID H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
14 patentsUS7018918B2Mar 28, 2006
Method of forming a selectively converted inter-layer dielectric using a porogen material
INTEL CORP76 citations97
US7005390B2Feb 28, 2006
Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials
INTEL CORP52 citations96
US6905958B2Jun 14, 2005
Protecting metal conductors with sacrificial organic monolayers
INTEL CORP52 citations96
US6858527B2Feb 22, 2005
Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
INTEL CORP51 citations96
US7238604B2Jul 3, 2007
Forming thin hard mask over air gap or porous dielectric
INTEL CORP42 citations92
US6974762B2Dec 13, 2005
Adhesion of carbon doped oxides by silanization
INTEL CORP19 citations92
US6943121B2Sep 13, 2005
Selectively converted inter-layer dielectric
INTEL CORP43 citations92
US7179757B2Feb 20, 2007
Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials
INTEL CORP11 citations84
US7205663B2Apr 17, 2007
Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
INTEL CORP4 citations74
US6620741B1Sep 16, 2003
Method for controlling etch bias of carbon doped oxide films
INTEL CORP12 citations74
US7208455B2Apr 24, 2007
Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
INTEL CORP2 citations63
US7268075B2Sep 11, 2007
Method to reduce the copper line roughness for increased electrical conductivity of narrow interconnects (<100nm)
INTEL CORP4 citations62
US7239019B2Jul 3, 2007
Selectively converted inter-layer dielectric
INTEL CORP2 citations62
US7175680B2Feb 13, 2007
Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
INTEL CORP0 citations52
GRACIAS DAVID H
6 patentsUS9375873B2Jun 28, 2016
Curved and flexible microfluidics
GRACIAS DAVID H3 citations63
US8709829B2Apr 29, 2014
Self-assembled, micropatterned, and radio frequency (RF) shielded biocontainers and their uses for remote spatially controlled chemical delivery
GRACIAS DAVID H2 citations59
US8246917B2Aug 21, 2012
Self-assembled, micropatterned, and radio frequency (RF) shielded biocontainers and their uses for remote spatially controlled chemical delivery
GRACIAS DAVID H4 citations59
US8236259B2Aug 7, 2012
Self-assembled, micropatterned, and radio frequency (RF) shielded biocontainers
GRACIAS DAVID H1 citations43
US11535510B2Dec 27, 2022
Self-folding sub-centimeter structures
GRACIAS DAVID H0 citations40
US9545772B2Jan 17, 2017
Array structures of containers
GRACIAS DAVID H0 citations27
UNIV JOHNS HOPKINS
6 patentsUS9005995B2Apr 14, 2015
Self-assembled, micropatterned, and radio frequency (RF) shielded biocontainers and their uses for remote spatially controlled chemical delivery
UNIV JOHNS HOPKINS2 citations60
US10722221B2Jul 28, 2020
Method and device for statistical tissue sampling using microdevices
UNIV JOHNS HOPKINS0 citations48
US12227624B2Feb 18, 2025
Molecular DNA strand-displacement controllers for directing material expansion
UNIV JOHNS HOPKINS0 citations47
US11332493B2May 17, 2022
Programmable soft robot
UNIV JOHNS HOPKINS0 citations47
US9108314B2Aug 18, 2015
Reconfigurable lithographic structures
UNIV JOHNS HOPKINS1 citations43
US10441760B2Oct 15, 2019
Self-actuating chemomechanical devices for delivery and extended release of therapeutic agents in the gastrointestinal tract
UNIV JOHNS HOPKINS0 citations35