Inventor
EGAWA YOSHIMI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “EGAWA YOSHIMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OKI ELECTRIC IND CO LTD
18 patentsUS6777797B2Aug 17, 2004
Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding
OKI ELECTRIC IND CO LTD138 citations99
US6259163B1Jul 10, 2001
Bond pad for stress releif between a substrate and an external substrate
OKI ELECTRIC IND CO LTD107 citations98
US6229215B1May 8, 2001
Semiconductor device and manufacturing method thereof
OKI ELECTRIC IND CO LTD62 citations96
US6870249B2Mar 22, 2005
Semiconductor device and manufacturing method thereof
OKI ELECTRIC IND CO LTD37 citations92
US6251704B1Jun 26, 2001
Method of manufacturing semiconductor devices having solder bumps with reduced cracks
OKI ELECTRIC IND CO LTD25 citations92
US6130480AOct 10, 2000
Structure for packaging semiconductor chip
OKI ELECTRIC IND CO LTD22 citations92
US5863815AJan 26, 1999
Method of manufacturing semiconductor device
OKI ELECTRIC IND CO LTD22 citations92
US6376278B1Apr 23, 2002
Methods for making a plurality of flip chip packages with a wafer scale resin sealing step
OKI ELECTRIC IND CO LTD33 citations89
US7215031B2May 8, 2007
Multi chip package
OKI ELECTRIC IND CO LTD10 citations84
US5994168ANov 30, 1999
Method of manufacturing semiconductor device
OKI ELECTRIC IND CO LTD15 citations82
US6426554B1Jul 30, 2002
Semiconductor device
OKI ELECTRIC IND CO LTD9 citations74
US6204563B1Mar 20, 2001
Semiconductor device
OKI ELECTRIC IND CO LTD10 citations74
US7002251B2Feb 21, 2006
Semiconductor device
OKI ELECTRIC IND CO LTD5 citations63
US6995038B2Feb 7, 2006
Method of manufacturing semiconductor device
OKI ELECTRIC IND CO LTD5 citations61
US6867069B2Mar 15, 2005
Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin
OKI ELECTRIC IND CO LTD3 citations59
US6635963B2Oct 21, 2003
Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin
OKI ELECTRIC IND CO LTD2 citations59
US7179685B2Feb 20, 2007
Fabrication method for stacked multi-chip package
OKI ELECTRIC IND CO LTD1 citations52
US7317244B2Jan 8, 2008
Semiconductor device and manufacturing method thereof
OKI ELECTRIC IND CO LTD0 citations41
EGAWA YOSHIMI
6 patentsUS8314492B2Nov 20, 2012
Semiconductor package and package-on-package semiconductor device
EGAWA YOSHIMI83 citations97
US8138023B2Mar 20, 2012
Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof
EGAWA YOSHIMI10 citations83
US8202391B2Jun 19, 2012
Camera module and method of manufacturing camera module
EGAWA YOSHIMI2 citations62
US8143718B2Mar 27, 2012
Semiconductor device having stress relaxation sections
EGAWA YOSHIMI2 citations62
US8435839B2May 7, 2013
Method of manufacturing semiconductor device and the semiconductor device
EGAWA YOSHIMI0 citations41
US8500984B2Aug 6, 2013
Method for manufacturing printed-circuit board
EGAWA YOSHIMI0 citations40
OKI SEMICONDUCTOR CO LTD
4 patentsUS7781880B2Aug 24, 2010
Semiconductor package
OKI SEMICONDUCTOR CO LTD7 citations74
US7898086B2Mar 1, 2011
Semiconductor device having a package base with at least one through electrode
OKI SEMICONDUCTOR CO LTD6 citations63
US7646086B2Jan 12, 2010
Semiconductor package
OKI SEMICONDUCTOR CO LTD5 citations63
US7560302B2Jul 14, 2009
Semiconductor device fabricating method
OKI SEMICONDUCTOR CO LTD2 citations63