Inventor
DIAZ-BOTIA CAMILO A
US3 patents
Patents
3 patentsUS11444056B2Sep 13, 2022
Sandwich assembly scheme for thin film electrode array and integrated circuits on both sides of printed circuit board (PCB) and method of manufacture
NEURALINK CORP5 citations68
US11107703B2Aug 31, 2021
Monolithic, biocompatible feedthrough for hermetically sealed electronics and methods of manufacture
NEURALINK CORP2 citations61
US12539083B2Feb 3, 2026
Electrode fabrication and design
NEURALINK CORP0 citations46