Inventor
HSU YU-CHEN
TW24 patents
⚠️ This page may combine multiple inventors who share the name “HSU YU-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
9 patentsUS11515229B2Nov 29, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10692848B2Jun 23, 2020
Stress reduction apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9780046B2Oct 3, 2017
Seal rings structures in semiconductor device interconnect layers and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9053990B2Jun 9, 2015
Bump interconnection techniques
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US12191224B2Jan 7, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12113055B2Oct 8, 2024
Stress reduction apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11244940B2Feb 8, 2022
Stress reduction apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10366971B2Jul 30, 2019
Pre-applying supporting materials between bonded package components
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9673184B2Jun 6, 2017
Packages with molding material forming steps
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52