Inventor
LIN ZHIHONG J
US5 patents
Patents
5 patentsUS5975740ANov 2, 1999
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC95 citations97
US6360132B2Mar 19, 2002
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC34 citations95
US6201998B1Mar 13, 2001
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC55 citations95
US6580955B2Jun 17, 2003
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC26 citations91
US6449520B1Sep 10, 2002
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC13 citations81