Inventor
WANG CHONGYANG
US27 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHONGYANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
12 patentsUS7925377B2Apr 12, 2011
Cluster tool architecture for processing a substrate
APPLIED MATERIALS INC45 citations97
US5975740ANov 2, 1999
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC95 citations97
US7743728B2Jun 29, 2010
Cluster tool architecture for processing a substrate
APPLIED MATERIALS INC36 citations96
US7694647B2Apr 13, 2010
Cluster tool architecture for processing a substrate
APPLIED MATERIALS INC42 citations96
US6360132B2Mar 19, 2002
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC34 citations95
US6201998B1Mar 13, 2001
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC55 citations95
US6580955B2Jun 17, 2003
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC26 citations91
US6449520B1Sep 10, 2002
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
APPLIED MATERIALS INC13 citations81
US12282315B2Apr 22, 2025
Scheduling substrate routing and processing
APPLIED MATERIALS INC0 citations62
US12009237B2Jun 11, 2024
Sequencer time leaping execution
APPLIED MATERIALS INC0 citations62
US11437254B2Sep 6, 2022
Sequencer time leaping execution
APPLIED MATERIALS INC0 citations62
US11385628B2Jul 12, 2022
Scheduling substrate routing and processing
APPLIED MATERIALS INC0 citations62
HUAWEI TECH CO LTD
6 patentsUS10740271B2Aug 11, 2020
Connecting apparatus and system
HUAWEI TECH CO LTD2 citations73
US9843510B2Dec 12, 2017
Method and network device for selecting label switched path
HUAWEI TECH CO LTD2 citations73
US11698877B2Jul 11, 2023
Connecting apparatus and system
HUAWEI TECH CO LTD0 citations62
US7447428B2Nov 4, 2008
Method and device for data-flow protection of optical interface in data communication equipment
HUAWEI TECH CO LTD2 citations58
US7580633B2Aug 25, 2009
Method and device for data-flow protection of optical interface in data communication equipment
HUAWEI TECH CO LTD0 citations48
US10129183B2Nov 13, 2018
Connection apparatus and connection apparatus management method
HUAWEI TECH CO LTD0 citations40
ISHIKAWA TETSUYA
4 patentsUS8550031B2Oct 8, 2013
Cluster tool architecture for processing a substrate
ISHIKAWA TETSUYA13 citations92
US8215262B2Jul 10, 2012
Cluster tool architecture for processing a substrate
ISHIKAWA TETSUYA15 citations92
US8181596B2May 22, 2012
Cluster tool architecture for processing a substrate
ISHIKAWA TETSUYA15 citations92
US8146530B2Apr 3, 2012
Cluster tool architecture for processing a substrate
ISHIKAWA TETSUYA22 citations92