P

Inventor

PARK MOON-HAN

KR34 patents
⚠️ This page may combine multiple inventors who share the name “PARK MOON-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

30 patents
US6566229B2May 20, 2003

Method of forming an insulating layer in a trench isolation type semiconductor device

SAMSUNG ELECTRONICS CO LTD102 citations97
US7385247B2Jun 10, 2008

At least penta-sided-channel type of FinFET transistor

SAMSUNG ELECTRONICS CO LTD46 citations96
US6835621B2Dec 28, 2004

Method of fabricating non-volatile memory device having a structure of silicon-oxide-nitride-oxide-silicon

SAMSUNG ELECTRONICS CO LTD69 citations96
US6331469B1Dec 18, 2001

Trench isolation structure, semiconductor device having the same, and trench isolation method

SAMSUNG ELECTRONICS CO LTD43 citations96
US6037237AMar 14, 2000

Trench isolation methods utilizing composite oxide films

SAMSUNG ELECTRONICS CO LTD74 citations96
US6717231B2Apr 6, 2004

Trench isolation regions having recess-inhibiting layers therein that protect against overetching

SAMSUNG ELECTRONICS CO LTD52 citations95
US6461937B1Oct 8, 2002

Methods of forming trench isolation regions having recess-inhibiting layers therein that protect against overetching

SAMSUNG ELECTRONICS CO LTD78 citations95
US5885883AMar 23, 1999

Methods of forming trench-based isolation regions with reduced susceptibility to edge defects

SAMSUNG ELECTRONICS CO LTD40 citations93
US7033895B2Apr 25, 2006

Method of fabricating a MOS transistor with elevated source/drain structure using a selective epitaxial growth process

SAMSUNG ELECTRONICS CO LTD22 citations92
US6482715B2Nov 19, 2002

Method of forming shallow trench isolation layer in semiconductor device

SAMSUNG ELECTRONICS CO LTD48 citations92
US6465866B2Oct 15, 2002

Trench isolation regions having trench liners with recessed ends

SAMSUNG ELECTRONICS CO LTD34 citations92
US6083808AJul 4, 2000

Method for forming a trench isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD19 citations92
US5858858AJan 12, 1999

Annealing methods for forming isolation trenches

SAMSUNG ELECTRONICS CO LTD28 citations92
US5728620AMar 17, 1998

Isolation method of semiconductor device

SAMSUNG ELECTRONICS CO LTD40 citations92
US7723193B2May 25, 2010

Method of forming an at least penta-sided-channel type of FinFET transistor

SAMSUNG ELECTRONICS CO LTD13 citations84
US5866435AFeb 2, 1999

Methods of fabricating profiled device isolation trenches in integrated circuits

SAMSUNG ELECTRONICS CO LTD9 citations74
US5674782AOct 7, 1997

Method for efficiently removing by-products produced in dry-etching

SAMSUNG ELECTRONICS CO LTD15 citations74
US6875670B2Apr 5, 2005

Trench isolation method

SAMSUNG ELECTRONICS CO LTD7 citations73
US6537914B1Mar 25, 2003

Integrated circuit device isolation methods using high selectivity chemical-mechanical polishing

SAMSUNG ELECTRONICS CO LTD12 citations73
US6878575B2Apr 12, 2005

Method of forming gate oxide layer in semiconductor devices

SAMSUNG ELECTRONICS CO LTD11 citations72
US11069820B2Jul 20, 2021

FinFET devices having active patterns and gate spacers on field insulating layers

SAMSUNG ELECTRONICS CO LTD2 citations71
US10224204B1Mar 5, 2019

Method of manufacturing integrated circuit device

SAMSUNG ELECTRONICS CO LTD3 citations71
US7439596B2Oct 21, 2008

Transistors for semiconductor device and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD5 citations63
US6987310B2Jan 17, 2006

Multi-layered structure including an epitaxial layer having a low dislocation defect density, semiconductor device comprising the same, and method of fabricating the semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations63
US6624041B2Sep 23, 2003

Method for forming trench type isolation film using annealing

SAMSUNG ELECTRONICS CO LTD6 citations63
US7294546B2Nov 13, 2007

Capacitor for a semiconductor device and method of fabricating same

SAMSUNG ELECTRONICS CO LTD2 citations62
US7368792B2May 6, 2008

MOS transistor with elevated source/drain structure

SAMSUNG ELECTRONICS CO LTD0 citations52
US10755932B2Aug 25, 2020

Method of manufacturing integrated circuit device

SAMSUNG ELECTRONICS CO LTD0 citations51
US10658249B2May 19, 2020

Methods for fabricating finFET devices having gate spacers on field insulating layers

SAMSUNG ELECTRONICS CO LTD0 citations50
US9793399B2Oct 17, 2017

Semiconductor device having insulating pattern and method of forming the same

SAMSUNG ELECTRONICS CO LTD0 citations49

LIM HA-JIN

2 patents

DO JIN-HO

1 patent

SONG MOON-KYUN

1 patent