Inventor
PARK MOON-HAN
KR34 patents
⚠️ This page may combine multiple inventors who share the name “PARK MOON-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
30 patentsUS6566229B2May 20, 2003
Method of forming an insulating layer in a trench isolation type semiconductor device
SAMSUNG ELECTRONICS CO LTD102 citations97
US7385247B2Jun 10, 2008
At least penta-sided-channel type of FinFET transistor
SAMSUNG ELECTRONICS CO LTD46 citations96
US6835621B2Dec 28, 2004
Method of fabricating non-volatile memory device having a structure of silicon-oxide-nitride-oxide-silicon
SAMSUNG ELECTRONICS CO LTD69 citations96
US6331469B1Dec 18, 2001
Trench isolation structure, semiconductor device having the same, and trench isolation method
SAMSUNG ELECTRONICS CO LTD43 citations96
US6037237AMar 14, 2000
Trench isolation methods utilizing composite oxide films
SAMSUNG ELECTRONICS CO LTD74 citations96
US6717231B2Apr 6, 2004
Trench isolation regions having recess-inhibiting layers therein that protect against overetching
SAMSUNG ELECTRONICS CO LTD52 citations95
US6461937B1Oct 8, 2002
Methods of forming trench isolation regions having recess-inhibiting layers therein that protect against overetching
SAMSUNG ELECTRONICS CO LTD78 citations95
US5885883AMar 23, 1999
Methods of forming trench-based isolation regions with reduced susceptibility to edge defects
SAMSUNG ELECTRONICS CO LTD40 citations93
US7033895B2Apr 25, 2006
Method of fabricating a MOS transistor with elevated source/drain structure using a selective epitaxial growth process
SAMSUNG ELECTRONICS CO LTD22 citations92
US6482715B2Nov 19, 2002
Method of forming shallow trench isolation layer in semiconductor device
SAMSUNG ELECTRONICS CO LTD48 citations92
US6465866B2Oct 15, 2002
Trench isolation regions having trench liners with recessed ends
SAMSUNG ELECTRONICS CO LTD34 citations92
US6083808AJul 4, 2000
Method for forming a trench isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD19 citations92
US5858858AJan 12, 1999
Annealing methods for forming isolation trenches
SAMSUNG ELECTRONICS CO LTD28 citations92
US5728620AMar 17, 1998
Isolation method of semiconductor device
SAMSUNG ELECTRONICS CO LTD40 citations92
US7723193B2May 25, 2010
Method of forming an at least penta-sided-channel type of FinFET transistor
SAMSUNG ELECTRONICS CO LTD13 citations84
US5866435AFeb 2, 1999
Methods of fabricating profiled device isolation trenches in integrated circuits
SAMSUNG ELECTRONICS CO LTD9 citations74
US5674782AOct 7, 1997
Method for efficiently removing by-products produced in dry-etching
SAMSUNG ELECTRONICS CO LTD15 citations74
US6875670B2Apr 5, 2005
Trench isolation method
SAMSUNG ELECTRONICS CO LTD7 citations73
US6537914B1Mar 25, 2003
Integrated circuit device isolation methods using high selectivity chemical-mechanical polishing
SAMSUNG ELECTRONICS CO LTD12 citations73
US6878575B2Apr 12, 2005
Method of forming gate oxide layer in semiconductor devices
SAMSUNG ELECTRONICS CO LTD11 citations72
US11069820B2Jul 20, 2021
FinFET devices having active patterns and gate spacers on field insulating layers
SAMSUNG ELECTRONICS CO LTD2 citations71
US10224204B1Mar 5, 2019
Method of manufacturing integrated circuit device
SAMSUNG ELECTRONICS CO LTD3 citations71
US7439596B2Oct 21, 2008
Transistors for semiconductor device and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations63
US6987310B2Jan 17, 2006
Multi-layered structure including an epitaxial layer having a low dislocation defect density, semiconductor device comprising the same, and method of fabricating the semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations63
US6624041B2Sep 23, 2003
Method for forming trench type isolation film using annealing
SAMSUNG ELECTRONICS CO LTD6 citations63
US7294546B2Nov 13, 2007
Capacitor for a semiconductor device and method of fabricating same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7368792B2May 6, 2008
MOS transistor with elevated source/drain structure
SAMSUNG ELECTRONICS CO LTD0 citations52
US10755932B2Aug 25, 2020
Method of manufacturing integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations51
US10658249B2May 19, 2020
Methods for fabricating finFET devices having gate spacers on field insulating layers
SAMSUNG ELECTRONICS CO LTD0 citations50
US9793399B2Oct 17, 2017
Semiconductor device having insulating pattern and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations49