Inventor
HOANG DINHPHUOC V
US7 patents
⚠️ This page may combine multiple inventors who share the name “HOANG DINHPHUOC V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HOANG DINHPHUOC V
4 patentsUS8071431B2Dec 6, 2011
Overmolded semiconductor package with a wirebond cage for EMI shielding
HOANG DINHPHUOC V119 citations96
US8399972B2Mar 19, 2013
Overmolded semiconductor package with a wirebond cage for EMI shielding
HOANG DINHPHUOC V86 citations95
US9041168B2May 26, 2015
Overmolded semiconductor package with wirebonds for electromagnetic shielding
HOANG DINHPHUOC V15 citations90
US9054115B2Jun 9, 2015
Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding
HOANG DINHPHUOC V7 citations82
LI YANG
3 patentsUS8941449B2Jan 27, 2015
Reducing coupling coefficient variation by using angled connecting traces
LI YANG16 citations91
US8928426B2Jan 6, 2015
Reducing coupling coefficient variation by using capacitors
LI YANG15 citations89
US8928427B2Jan 6, 2015
Reducing coupling coefficient variation using intended width mismatch
LI YANG14 citations89