Inventor
READ MATTHEW S
US4 patents
Patents
4 patentsUS8071431B2Dec 6, 2011
Overmolded semiconductor package with a wirebond cage for EMI shielding
HOANG DINHPHUOC V119 citations96
US8399972B2Mar 19, 2013
Overmolded semiconductor package with a wirebond cage for EMI shielding
HOANG DINHPHUOC V86 citations95
US9041168B2May 26, 2015
Overmolded semiconductor package with wirebonds for electromagnetic shielding
HOANG DINHPHUOC V15 citations90
US9054115B2Jun 9, 2015
Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding
HOANG DINHPHUOC V7 citations82