Inventor
JOHNSON HALE
US17 patents
⚠️ This page may combine multiple inventors who share the name “JOHNSON HALE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUSS MICROTEC LITHOGRAPHY GMBH
10 patentsUS10825705B2Nov 3, 2020
Apparatus, system, and method for handling aligned wafer pairs
SUSS MICROTEC LITHOGRAPHY GMBH2 citations72
US9875917B2Jan 23, 2018
Semiconductor bonding apparatus and related techniques
SUSS MICROTEC LITHOGRAPHY GMBH2 citations72
US9281229B2Mar 8, 2016
Method for thermal-slide debonding of temporary bonded semiconductor wafers
SUSS MICROTEC LITHOGRAPHY GMBH3 citations71
US9859141B2Jan 2, 2018
Apparatus and method for aligning and centering wafers
SUSS MICROTEC LITHOGRAPHY GMBH2 citations70
US9837295B2Dec 5, 2017
Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
SUSS MICROTEC LITHOGRAPHY GMBH3 citations70
US11651983B2May 16, 2023
Apparatus, system, and method for handling aligned wafer pairs
SUSS MICROTEC LITHOGRAPHY GMBH0 citations62
US11183401B2Nov 23, 2021
System and related techniques for handling aligned substrate pairs
SUSS MICROTEC LITHOGRAPHY GMBH0 citations55
US10319615B2Jun 11, 2019
Semiconductor bonding apparatus and related techniques
SUSS MICROTEC LITHOGRAPHY GMBH0 citations51
US9640418B2May 2, 2017
Apparatus, system, and method for handling aligned wafer pairs
SUSS MICROTEC LITHOGRAPHY GMBH0 citations51
US10580678B2Mar 3, 2020
Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
SUSS MICROTEC LITHOGRAPHY GMBH0 citations49
GEORGE GREGORY
3 patentsUS8267143B2Sep 18, 2012
Apparatus for mechanically debonding temporary bonded semiconductor wafers
GEORGE GREGORY23 citations90
US8764026B2Jul 1, 2014
Device for centering wafers
GEORGE GREGORY8 citations79
US8919412B2Dec 30, 2014
Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers
GEORGE GREGORY3 citations60