Inventor

HAIMERL ALFRED

DE37 patents

⚠️ This page may combine multiple inventors who share the name “HAIMERL ALFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAIMERL ALFRED

INFINEON TECHNOLOGIES AG

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device having a sensor chip, and method for producing the same

Sensor component with a cavity housing and a sensor chip and method for producing the same

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor component and sensor component for data transmission devices

Semiconductor module with at least two substrates

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor module having discrete components and method for producing the same

Semiconductor component including semiconductor chip and method for producing the same

Semiconductor device with semiconductor chip and method for producing it

Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Flexible rewiring plate for semiconductor components, and process for producing it

Chip arrangement and method for producing a chip arrangement

Semiconductor chip comprising a metal coating structure and associated production method

Layer between interfaces of different components in semiconductor devices

Lead structure for a semiconductor component and method for producing the same

Electronic component with flexible bonding pads and method of producing such a component

Smart card module, smart card, and method for producing a smart card module

Substrate-based chip package

Semiconductor device including a stress buffer

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

Component arrangement comprising a carrier

Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite

Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof

Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers

Semiconductor component having a stack of semiconductor chips and method for producing the same

Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition

Electronic module with a semiconductor chip and a component housing and methods for producing the same

MAHLER JOACHIM

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

Semiconductor component and production method

Chip arrangement and method for producing a chip arrangement

Semiconductor component and production method

Chip arrangement and method for producing a chip arrangement

QIMONDA AG

Method of producing an electronic component with flexible bonding