Inventor

AKIYAMA HIROKO

JP3 patents

⚠️ This page may combine multiple inventors who share the name “AKIYAMA HIROKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

3M INNOVATIVE PROPERTIES CO

1 patent

US9773714B2Sep 26, 2017

Semiconductor package resin composition and usage method thereof

3M INNOVATIVE PROPERTIES CO0 citations49

KAWATE KOHICHIRO

1 patent

US9230873B2Jan 5, 2016

Semiconductor package resin composition and usage method thereof

KAWATE KOHICHIRO1 citations43

AKIYAMA HIROKO

1 patent

US9333723B2May 10, 2016

Adhesive composition

AKIYAMA HIROKO0 citations39