Inventor

JUNG YONGJIN

KR3 patents

⚠️ This page may combine multiple inventors who share the name “JUNG YONGJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US9698117B2Jul 4, 2017

Die bonding apparatus

SAMSUNG ELECTRONICS CO LTD8 citations78

US7989939B2Aug 2, 2011

Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire

SAMSUNG ELECTRONICS CO LTD3 citations55

NAKAMURA KENTARO

1 patent

US9516133B2Dec 6, 2016

Information processing device, information processing method and information processing program

NAKAMURA KENTARO2 citations59