Inventor
RENNER GARRY L
US13 patents
⚠️ This page may combine multiple inventors who share the name “RENNER GARRY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KEMET ELECTRONICS CORP
10 patentsUS9793057B2Oct 17, 2017
Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond
KEMET ELECTRONICS CORP12 citations84
US9472342B2Oct 18, 2016
Leadless multi-layered ceramic capacitor stacks
KEMET ELECTRONICS CORP13 citations83
US9881744B2Jan 30, 2018
Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds
KEMET ELECTRONICS CORP3 citations73
US10068707B2Sep 4, 2018
Leadless multi-layered ceramic capacitor stacks
KEMET ELECTRONICS CORP2 citations72
US9805872B2Oct 31, 2017
Multiple MLCC modules
KEMET ELECTRONICS CORP5 citations72
US10381162B2Aug 13, 2019
Leadless stack comprising multiple components
KEMET ELECTRONICS CORP5 citations71
US11227719B2Jan 18, 2022
Leadless multi-layered ceramic capacitor stack
KEMET ELECTRONICS CORP0 citations61
US10790094B2Sep 29, 2020
Method of forming a leadless stack comprising multiple components
KEMET ELECTRONICS CORP0 citations50
US10229785B2Mar 12, 2019
Multi-layered ceramic capacitor with soft leaded module
KEMET ELECTRONICS CORP0 citations50
US10224149B2Mar 5, 2019
Bulk MLCC capacitor module
KEMET ELECTRONICS CORP0 citations41