Inventor

Wang yao bin

TW6 patents

⚠️ This page may combine multiple inventors who share the name “Wang yao bin”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

5 patents

US9406607B2Aug 2, 2016

Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations82

US10269699B2Apr 23, 2019

Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

US9893010B2Feb 13, 2018

Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

US11075162B2Jul 27, 2021

Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

US10629528B2Apr 21, 2020

Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

Ma wei yu

1 patent

US8569129B2Oct 29, 2013

Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

Ma wei yu9 citations81