P

Inventor

SONG IN-SANG

KR158 patents
⚠️ This page may combine multiple inventors who share the name “SONG IN-SANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

41 patents
US7285865B2Oct 23, 2007

Micro-package, multi-stack micro-package, and manufacturing method therefor

SAMSUNG ELECTRONICS CO LTD57 citations96
US7233218B2Jun 19, 2007

Air-gap type FBAR, and duplexer using the FBAR

SAMSUNG ELECTRONICS CO LTD47 citations96
US7053730B2May 30, 2006

Fabricating methods for air-gap type FBARs and duplexers including securing a resonating part substrate to a cavity forming substrate

SAMSUNG ELECTRONICS CO LTD43 citations96
US7281304B2Oct 16, 2007

Method for fabricating a film bulk acoustic resonator

SAMSUNG ELECTRONICS CO LTD57 citations94
US9634643B2Apr 25, 2017

Bulk acoustic wave resonator

SAMSUNG ELECTRONICS CO LTD16 citations93
US9129846B2Sep 8, 2015

Semiconductor package and method of forming

SAMSUNG ELECTRONICS CO LTD20 citations93
US7759591B2Jul 20, 2010

Pneumatic MEMS switch and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD22 citations93
US7671427B2Mar 2, 2010

Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby

SAMSUNG ELECTRONICS CO LTD19 citations93
US7622846B2Nov 24, 2009

Bulk acoustic wave resonator, filter and duplexer and methods of making same

SAMSUNG ELECTRONICS CO LTD24 citations93
US6960971B2Nov 1, 2005

Microelectro mechanical system switch

SAMSUNG ELECTRONICS CO LTD26 citations93
US7545081B2Jun 9, 2009

Piezoelectric RF MEMS device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD41 citations92
US7423501B2Sep 9, 2008

Film bulk acoustic wave resonator and manufacturing method thererof

SAMSUNG ELECTRONICS CO LTD22 citations92
US7374972B2May 20, 2008

Micro-package, multi-stack micro-package, and manufacturing method therefor

SAMSUNG ELECTRONICS CO LTD18 citations92
US7224245B2May 29, 2007

Duplexer fabricated with monolithic FBAR and isolation part and a method thereof

SAMSUNG ELECTRONICS CO LTD23 citations92
US7122942B2Oct 17, 2006

Electrostatic RF MEMS switches

SAMSUNG ELECTRONICS CO LTD24 citations92
US8829667B2Sep 9, 2014

Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD24 citations91
US9385303B2Jul 5, 2016

Resonator and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD9 citations84
US8018308B2Sep 13, 2011

Downward type MEMS switch and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD14 citations84
US7804382B2Sep 28, 2010

Tunable resonator using film bulk acoustic resonator (FBAR)

SAMSUNG ELECTRONICS CO LTD10 citations84
US7786573B2Aug 31, 2010

Packaging chip having interconnection electrodes directly connected to plural wafers

SAMSUNG ELECTRONICS CO LTD16 citations84
US7728703B2Jun 1, 2010

RF MEMS switch and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD10 citations84
US7701312B2Apr 20, 2010

Integrated device and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD13 citations84
US7642882B2Jan 5, 2010

Multi-band filter module and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD13 citations84
US7612428B2Nov 3, 2009

Inductor fabricated with dry film resist and cavity and method of fabricating the inductor

SAMSUNG ELECTRONICS CO LTD8 citations84
US7545246B2Jun 9, 2009

Piezoelectric MEMS switch and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD16 citations84
US7511595B2Mar 31, 2009

Multi-band filter module and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD17 citations84
US7498900B2Mar 3, 2009

System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof

SAMSUNG ELECTRONICS CO LTD10 citations84
US7446634B2Nov 4, 2008

MEMS switch and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD13 citations84
US7417525B2Aug 26, 2008

High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor

SAMSUNG ELECTRONICS CO LTD18 citations84
US7408257B2Aug 5, 2008

Packaging chip and packaging method thereof

SAMSUNG ELECTRONICS CO LTD11 citations84
US7253704B2Aug 7, 2007

RF duplexer

SAMSUNG ELECTRONICS CO LTD10 citations84
US7250831B2Jul 31, 2007

Filter comprising inductor, duplexer using the filter and fabricating methods thereof

SAMSUNG ELECTRONICS CO LTD13 citations84
US9842980B2Dec 12, 2017

Resonance apparatus for processing electrical loss using conductive material and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD10 citations82
US7675154B2Mar 9, 2010

RF module with multi-stack structure

SAMSUNG ELECTRONICS CO LTD12 citations82
US7471167B2Dec 30, 2008

Balun

SAMSUNG ELECTRONICS CO LTD13 citations82
US7554426B2Jun 30, 2009

Resonator, apparatus having the same and fabrication method of resonator

SAMSUNG ELECTRONICS CO LTD16 citations81
US7919903B2Apr 5, 2011

MEMS switch

SAMSUNG ELECTRONICS CO LTD5 citations74
US7830226B2Nov 9, 2010

Film bulk acoustic resonator filter and duplexer

SAMSUNG ELECTRONICS CO LTD7 citations74
US7793395B2Sep 14, 2010

Method for manufacturing a film bulk acoustic resonator

SAMSUNG ELECTRONICS CO LTD5 citations74
US7456709B2Nov 25, 2008

Bulk acoustic resonator including a resonance part with dimple and fabrication method therefor

SAMSUNG ELECTRONICS CO LTD7 citations74
US7411261B2Aug 12, 2008

MEMS device and fabrication method thereof

SAMSUNG ELECTRONICS CO LTD5 citations74

SONG IN-SANG

3 patents

LG ELECTRONICS INC

3 patents

KIM CHUL-SOO

1 patent

SHIN JEA SHIK

1 patent

SON SANG UK

1 patent

Showing the top 50 of 158 patents by PatentIndex Score.