Inventor
REVIER DANIEL LEE
US33 patents
Patents
33 patentsUS10908414B2Feb 2, 2021
Lens cleaning via electrowetting
TEXAS INSTRUMENTS INC17 citations94
US11693235B2Jul 4, 2023
Lens cleaning via electrowetting
TEXAS INSTRUMENTS INC2 citations73
US10910465B2Feb 2, 2021
3D printed semiconductor package
TEXAS INSTRUMENTS INC3 citations73
US10780467B2Sep 22, 2020
Methods and apparatus for surface wetting control
TEXAS INSTRUMENTS INC3 citations73
US10444432B2Oct 15, 2019
Galvanic signal path isolation in an encapsulated package using a photonic structure
TEXAS INSTRUMENTS INC3 citations73
US10371891B2Aug 6, 2019
Integrated circuit with dielectric waveguide connector using photonic bandgap structure
TEXAS INSTRUMENTS INC3 citations73
US11865773B2Jan 9, 2024
Additive process for circular printing of electronic devices
TEXAS INSTRUMENTS INC3 citations71
US11031364B2Jun 8, 2021
Nanoparticle backside die adhesion layer
TEXAS INSTRUMENTS INC2 citations71
US12532772B2Jan 20, 2026
Thermal management in integrated circuit using phononic bandgap structure
TEXAS INSTRUMENTS INC0 citations62
US12457756B2Oct 28, 2025
3D printed semiconductor package
TEXAS INSTRUMENTS INC0 citations62
US12042829B2Jul 23, 2024
Methods and apparatus for surface wetting control
TEXAS INSTRUMENTS INC0 citations62
US11869925B2Jan 9, 2024
3D printed semiconductor package
TEXAS INSTRUMENTS INC0 citations62
US11854933B2Dec 26, 2023
Thermally conductive wafer layer
TEXAS INSTRUMENTS INC1 citations62
US11607704B2Mar 21, 2023
Methods and apparatus for electrostatic control of expelled material for lens cleaners
TEXAS INSTRUMENTS INC0 citations62
US11417540B2Aug 16, 2022
3D printed semiconductor package
TEXAS INSTRUMENTS INC0 citations62
US11355414B2Jun 7, 2022
Nanoparticle matrix for backside heat spreading
TEXAS INSTRUMENTS INC0 citations62
US10886187B2Jan 5, 2021
Thermal management in integrated circuit using phononic bandgap structure
TEXAS INSTRUMENTS INC0 citations62
US10788367B2Sep 29, 2020
Integrated circuit using photonic bandgap structure
TEXAS INSTRUMENTS INC1 citations62
US10622270B2Apr 14, 2020
Integrated circuit package with stress directing material
TEXAS INSTRUMENTS INC1 citations62
US10557754B2Feb 11, 2020
Spectrometry in integrated circuit using a photonic bandgap structure
TEXAS INSTRUMENTS INC1 citations62
US10497651B2Dec 3, 2019
Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
TEXAS INSTRUMENTS INC1 citations62
US12046430B2Jul 23, 2024
Liquid metal MEMS switch
TEXAS INSTRUMENTS INC0 citations61
US11728111B2Aug 15, 2023
Liquid metal MEMS switch
TEXAS INSTRUMENTS INC0 citations61
US11676930B2Jun 13, 2023
Nanoparticle backside die adhesion layer
TEXAS INSTRUMENTS INC0 citations60
US10879151B2Dec 29, 2020
Semiconductor package with liquid metal conductors
TEXAS INSTRUMENTS INC1 citations60
US12172374B2Dec 24, 2024
Additive process for circular printing
TEXAS INSTRUMENTS INC0 citations59
US11271296B2Mar 8, 2022
Molded packaged antenna
TEXAS INSTRUMENTS INC0 citations55
US11404270B2Aug 2, 2022
Microelectronic device substrate formed by additive process
TEXAS INSTRUMENTS INC0 citations52
US10861715B2Dec 8, 2020
3D printed semiconductor package
TEXAS INSTRUMENTS INC0 citations52
US10833648B2Nov 10, 2020
Acoustic management in integrated circuit using phononic bandgap structure
TEXAS INSTRUMENTS INC0 citations52
US10553573B2Feb 4, 2020
Self-assembly of semiconductor die onto a leadframe using magnetic fields
TEXAS INSTRUMENTS INC0 citations52
US10170384B2Jan 1, 2019
Methods and apparatus providing a graded package for a semiconductor
TEXAS INSTRUMENTS INC0 citations52
US11487206B2Nov 1, 2022
Methods and apparatus for digital material deposition onto semiconductor wafers
TEXAS INSTRUMENTS INC0 citations49