P

Inventor

LIN HUNG-YI

TW98 patents
⚠️ This page may combine multiple inventors who share the name “LIN HUNG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

20 patents
US11063013B2Jul 13, 2021

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG10 citations86
US9997447B1Jun 12, 2018

Semiconductor devices

ADVANCED SEMICONDUCTOR ENG14 citations84
US11824029B2Nov 21, 2023

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG2 citations73
US11798890B2Oct 24, 2023

Assembly structure and package structure

ADVANCED SEMICONDUCTOR ENG2 citations73
US11348885B2May 31, 2022

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations73
US11296043B2Apr 5, 2022

Semiconductor device packages and methods of manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations73
US10490341B2Nov 26, 2019

Electrical device

ADVANCED SEMICONDUCTOR ENG2 citations73
US11342282B2May 24, 2022

Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG4 citations71
US10475718B2Nov 12, 2019

Semiconductor device package comprising a dielectric layer with built-in inductor

ADVANCED SEMICONDUCTOR ENG5 citations71
US12374631B2Jul 29, 2025

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US12368104B2Jul 22, 2025

Electronic package

ADVANCED SEMICONDUCTOR ENG0 citations62
US12051658B2Jul 30, 2024

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11935841B2Mar 19, 2024

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11722220B2Aug 8, 2023

System comprising packaged optical devices

ADVANCED SEMICONDUCTOR ENG0 citations62
US11508668B2Nov 22, 2022

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US11233010B2Jan 25, 2022

Assembly structure and package structure

ADVANCED SEMICONDUCTOR ENG0 citations62
US11037846B2Jun 15, 2021

Semiconductor package structure and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US10903907B1Jan 26, 2021

System comprising packaged optical devices

ADVANCED SEMICONDUCTOR ENG0 citations62
US12463157B2Nov 4, 2025

Electronic package

ADVANCED SEMICONDUCTOR ENG0 citations61
US11784111B2Oct 10, 2023

Semiconductor device and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations61

TOUCH MICRO SYSTEM TECH

6 patents

IND TECH RES INST

4 patents

POWER QUOTIENT INT CO LTD

2 patents

LIN HUNG-YI

2 patents

ASUSTEK COMP INC

2 patents

MSTAR SEMICONDUCTOR INC

2 patents

WALSIN LIHWA CORP

1 patent

KINPO ELECT INC

1 patent

CHANG JEN-TANG

1 patent

(unassigned)

1 patent

WU MENG TSUNG

1 patent

ADAM ELEMENTS INT CO LTD

1 patent

CHENG KUN-NAN

1 patent

UNIV NAT TAIPEI TECHNOLOGY

1 patent

FLIR SYSTEMS AB

1 patent

NOVATEK MICROELECTRONICS CORP

1 patent

CHIANG CHUNG-I

1 patent

WISTRON NEWEB CORP

1 patent

Showing the top 50 of 98 patents by PatentIndex Score.