Inventor
LIN HUNG-YI
TW98 patents
⚠️ This page may combine multiple inventors who share the name “LIN HUNG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
20 patentsUS11063013B2Jul 13, 2021
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG10 citations86
US9997447B1Jun 12, 2018
Semiconductor devices
ADVANCED SEMICONDUCTOR ENG14 citations84
US11824029B2Nov 21, 2023
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG2 citations73
US11798890B2Oct 24, 2023
Assembly structure and package structure
ADVANCED SEMICONDUCTOR ENG2 citations73
US11348885B2May 31, 2022
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations73
US11296043B2Apr 5, 2022
Semiconductor device packages and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations73
US10490341B2Nov 26, 2019
Electrical device
ADVANCED SEMICONDUCTOR ENG2 citations73
US11342282B2May 24, 2022
Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations71
US10475718B2Nov 12, 2019
Semiconductor device package comprising a dielectric layer with built-in inductor
ADVANCED SEMICONDUCTOR ENG5 citations71
US12374631B2Jul 29, 2025
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US12368104B2Jul 22, 2025
Electronic package
ADVANCED SEMICONDUCTOR ENG0 citations62
US12051658B2Jul 30, 2024
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11935841B2Mar 19, 2024
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11722220B2Aug 8, 2023
System comprising packaged optical devices
ADVANCED SEMICONDUCTOR ENG0 citations62
US11508668B2Nov 22, 2022
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US11233010B2Jan 25, 2022
Assembly structure and package structure
ADVANCED SEMICONDUCTOR ENG0 citations62
US11037846B2Jun 15, 2021
Semiconductor package structure and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US10903907B1Jan 26, 2021
System comprising packaged optical devices
ADVANCED SEMICONDUCTOR ENG0 citations62
US12463157B2Nov 4, 2025
Electronic package
ADVANCED SEMICONDUCTOR ENG0 citations61
US11784111B2Oct 10, 2023
Semiconductor device and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations61
TOUCH MICRO SYSTEM TECH
6 patentsUS7741772B2Jun 22, 2010
White LED package structure having a silicon substrate and method of making the same
TOUCH MICRO SYSTEM TECH8 citations84
US7514287B2Apr 7, 2009
Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS device
TOUCH MICRO SYSTEM TECH17 citations80
US7392687B2Jul 1, 2008
Method of calibrating zero offset of a pressure sensor
TOUCH MICRO SYSTEM TECH13 citations80
US7732233B2Jun 8, 2010
Method for making light emitting diode chip package
TOUCH MICRO SYSTEM TECH12 citations78
US8453318B2Jun 4, 2013
Method for making a planar coil
TOUCH MICRO SYSTEM TECH2 citations63
US7510892B2Mar 31, 2009
Light emitting diode structure and manufacturing method thereof
TOUCH MICRO SYSTEM TECH2 citations62
IND TECH RES INST
4 patentsUS6372610B1Apr 16, 2002
Method for die separation of a wafer by ion implantation
IND TECH RES INST27 citations87
US6421224B1Jul 16, 2002
Micro-structure capacitor
IND TECH RES INST10 citations71
US6739946B1May 25, 2004
Thermal-chemical polishing device and method thereof
IND TECH RES INST7 citations65
US7934314B2May 3, 2011
Conductive film structure, fabrication method thereof, and conductive film type probe device for IC
IND TECH RES INST2 citations62
POWER QUOTIENT INT CO LTD
2 patentsLIN HUNG-YI
2 patentsASUSTEK COMP INC
2 patentsMSTAR SEMICONDUCTOR INC
2 patentsWALSIN LIHWA CORP
1 patentKINPO ELECT INC
1 patentCHANG JEN-TANG
1 patent(unassigned)
1 patentWU MENG TSUNG
1 patentADAM ELEMENTS INT CO LTD
1 patentCHENG KUN-NAN
1 patentUNIV NAT TAIPEI TECHNOLOGY
1 patentFLIR SYSTEMS AB
1 patentNOVATEK MICROELECTRONICS CORP
1 patentCHIANG CHUNG-I
1 patentWISTRON NEWEB CORP
1 patentShowing the top 50 of 98 patents by PatentIndex Score.