Inventor
KLODOWSKI MICHAEL JOSEPH
US16 patents
Patents
16 patentsUS6902869B2Jun 7, 2005
Manufacturing methods for printed circuit boards
IBM156 citations97
US6222136B1Apr 24, 2001
Printed circuit board with continuous connective bumps
IBM131 citations97
US6214525B1Apr 10, 2001
Printed circuit board with circuitized cavity and methods of producing same
IBM105 citations97
US5981312ANov 9, 1999
Method for injection molded flip chip encapsulation
IBM72 citations96
US6015520AJan 18, 2000
Method for filling holes in printed wiring boards
IBM84 citations95
US6329713B1Dec 11, 2001
Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate
IBM68 citations94
US6369449B2Apr 9, 2002
Method and apparatus for injection molded flip chip encapsulation
IBM23 citations92
US6066386AMay 23, 2000
Printed circuit board with cavity for circuitization
IBM27 citations92
US5784782AJul 28, 1998
Method for fabricating printed circuit boards with cavities
IBM44 citations92
US6684497B2Feb 3, 2004
Manufacturing methods for printed circuit boards
IBM16 citations91
US6503821B2Jan 7, 2003
Integrated circuit chip carrier assembly
IBM39 citations91
US6675852B2Jan 13, 2004
Platen for use in laminating press
IBM14 citations81
US6570261B2May 27, 2003
Method and apparatus for injection molded flip chip encapsulation
IBM11 citations73
US7240430B2Jul 10, 2007
Manufacturing methods for printed circuit boards
IBM2 citations61
US7063756B2Jun 20, 2006
Enhanced design and process for a conductive adhesive
IBM2 citations57
US6534724B1Mar 18, 2003
Enhanced design and process for a conductive adhesive
IBM0 citations47