Inventor · disambiguated record
Zhimin Jamie Yao
Also filed as: YAO ZHIMIN · YAO ZHIMIN J · YAO ZHIMIN JAMIE
17 granted patents·3 pending applications·437 citations·filing 1999–2023
94Inventor score
Top patents by PatentIndex Score
20 records- 0198US8368100B2Semiconductor light emitting diodes having reflective structures and methods of fabricating sameCREE INC·Filed 2009·Granted Feb 5, 2013·73 cites·43 claims
- 0296US8772817B2Electronic device submounts including substrates with thermally conductive viasYAO ZHIMIN JAMIE·Filed 2010·Granted Jul 8, 2014·47 cites·24 claims
- 0396US8643039B2Lateral semiconductor Light Emitting Diodes having large area contactsDONOFRIO MATTHEW·Filed 2011·Granted Feb 4, 2014·15 cites·23 claims
- 0496US8536584B2High voltage wire bond free LEDSYAO ZHIMIN JAMIE·Filed 2010·Granted Sep 17, 2013·45 cites·49 claims
- 0594US6391675B1Method and apparatus for switching high frequency signalsRAYTHEON CO·Filed 1999·Granted May 21, 2002·112 cites·11 claims
- 0692US8329482B2White-emitting LED chips and method for making sameYAO ZHIMIN JAMIE·Filed 2010·Granted Dec 11, 2012·16 cites·45 claims
- 0790US11600588B1Superconducting bump bonds for quantum computing systemsGOOGLE LLC·Filed 2021·Granted Mar 7, 2023·2 cites·7 claims
- 0887US10439107B2Chip with integrated phosphorCREE INC·Filed 2013·Granted Oct 8, 2019·6 cites·33 claims
- 0987US9105824B2High reflective board or substrate for LEDsHEIKMAN STEN·Filed 2012·Granted Aug 11, 2015·9 cites·42 claims
- 1083US6803534B1Membrane for micro-electro-mechanical switch, and methods of making and using itRAYTHEON CO·Filed 2001·Granted Oct 12, 2004·63 cites·30 claims
- 1181US7538032B2Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said methodTELEDYNE SCIENT & IMAGING LLC·Filed 2005·Granted May 26, 2009·12 cites·20 claims
- 1273US12218091B2Superconducting bump bonds for quantum computing systemsGOOGLE LLC·Filed 2023·Granted Feb 4, 2025·0 cites·16 claims
- 1368US9391247B2High power LEDs with non-polymer material lenses and methods of making the sameYAO ZHIMIN JAMIE·Filed 2010·Granted Jul 12, 2016·2 cites·22 claims
- 1468US6147582ASubstrate supported three-dimensional micro-coilRAYTHEON CO·Filed 1999·Granted Nov 14, 2000·24 cites·6 claims
- 1566US6700172B2Method and apparatus for switching high frequency signalsRAYTHEON CO·Filed 2001·Granted Mar 2, 2004·11 cites·12 claims
- 1653US2024194532A1Multi-layer chip architecture and fabricationGOOGLE LLC·Filed 2022·Application pending·0 cites
- 1753US2024194661A1Multi-layer chip architecture and fabricationGOOGLE LLC·Filed 2022·Application pending·0 cites
- 1852US2015137151A1High power ledsCREE INC·Filed 2014·Application pending·0 cites
- 1946US8455882B2High efficiency LEDsYAO ZHIMIN JAMIE·Filed 2011·Granted Jun 4, 2013·0 cites·87 claims
- 2040US9324613B2Method for forming through substrate vias with tethersINNOVATIVE MICRO TECHNOLOGY·Filed 2015·Granted Apr 26, 2016·0 cites·23 claims
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