Inventor

HIEW SIEW S

US19 patents

⚠️ This page may combine multiple inventors who share the name “HIEW SIEW S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIEW SIEW S

SUPER TALENT ELECTRONICS INC

Extended COB-USB with dual-personality contacts

Single chip USB packages with swivel cover

Extended USB dual-personality card reader

Single chip USB packages with contact-pins cover

Single chip USB packages by various assembly methods

Light-weight solid state drive with rivet sets

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Solid state drive (SSD) with open top and bottom covers

Manufacturing method for single chip COB USB devices with optional embedded LED

Molding methods to manufacture single-chip chip-on-board USB device

USB device with connected cap

High density memory device manufacturing using isolated step pads

HIEW SIEW S

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Manufacturing method for micro-SD flash memory card

Micro-SD to secure digital adaptor card and manufacturing method

USB package with bistable sliding mechanism

Molded memory card with write protection switch assembly

High throughput manufacturing method for micro flash memory cards