Inventor
MEYER NEAL W
US17 patents
⚠️ This page may combine multiple inventors who share the name “MEYER NEAL W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD CO
9 patentsUS6290331B1Sep 18, 2001
High efficiency orifice plate structure and printhead using the same
HEWLETT PACKARD CO96 citations95
US6155675ADec 5, 2000
Printhead structure and method for producing the same
HEWLETT PACKARD CO61 citations93
US5300959AApr 5, 1994
Efficient conductor routing for inkjet printhead
HEWLETT PACKARD CO46 citations92
US5682188AOct 28, 1997
Printhead with unpassivated heater resistors having increased resistance
HEWLETT PACKARD CO39 citations91
US5636441AJun 10, 1997
Method of forming a heating element for a printhead
HEWLETT PACKARD CO31 citations91
US6130688AOct 10, 2000
High efficiency orifice plate structure and printhead using the same
HEWLETT PACKARD CO28 citations89
US6062679AMay 16, 2000
Printhead for an inkjet cartridge and method for producing the same
HEWLETT PACKARD CO35 citations89
US6471340B2Oct 29, 2002
Inkjet printhead assembly
HEWLETT PACKARD CO12 citations73
US6315393B1Nov 13, 2001
Ink-jet printhead
HEWLETT PACKARD CO10 citations71
HEWLETT PACKARD DEVELOPMENT CO
8 patentsUS7262495B2Aug 28, 2007
3D interconnect with protruding contacts
HEWLETT PACKARD DEVELOPMENT CO395 citations99
US6967149B2Nov 22, 2005
Storage structure with cleaved layer
HEWLETT PACKARD DEVELOPMENT CO259 citations98
US7790331B1Sep 7, 2010
Fuel cell with film having nanowires therein
HEWLETT PACKARD DEVELOPMENT CO7 citations74
US6936496B2Aug 30, 2005
Nanowire filament
HEWLETT PACKARD DEVELOPMENT CO9 citations72
US7833830B2Nov 16, 2010
3D interconnect with protruding contacts
HEWLETT PACKARD DEVELOPMENT CO2 citations63
US7082378B2Jul 25, 2006
Displacement sensing by comparing matrices of pointwise measurements
HEWLETT PACKARD DEVELOPMENT CO4 citations63
US7294899B2Nov 13, 2007
Nanowire Filament
HEWLETT PACKARD DEVELOPMENT CO3 citations61
US6821848B2Nov 23, 2004
Tunnel-junction structures and methods
HEWLETT PACKARD DEVELOPMENT CO0 citations51