Inventor
LEENSTRA BOUWE W
US9 patents
⚠️ This page may combine multiple inventors who share the name “LEENSTRA BOUWE W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS6281452B1Aug 28, 2001
Multi-level thin-film electronic packaging structure and related method
IBM53 citations95
US6678949B2Jan 20, 2004
Process for forming a multi-level thin-film electronic packaging structure
IBM21 citations92
US6099935AAug 8, 2000
Apparatus for providing solder interconnections to semiconductor and electronic packaging devices
IBM24 citations91
US9278401B2Mar 8, 2016
Fill head interface with combination vacuum pressure chamber
IBM5 citations72
US6149048ANov 21, 2000
Apparatus and method for use in manufacturing semiconductor devices
IBM7 citations72
US5905566AMay 18, 1999
Laser ablation top surface reference chuck
IBM10 citations70
US7401637B2Jul 22, 2008
Pressure-only molten metal valving apparatus and method
IBM3 citations62
US6448169B1Sep 10, 2002
Apparatus and method for use in manufacturing semiconductor devices
IBM5 citations61