Inventor

PARK MYUNG GEUN

KR11 patents

⚠️ This page may combine multiple inventors who share the name “PARK MYUNG GEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HYNIX SEMICONDUCTOR INC

3 patents

US7595255B2Sep 29, 2009

Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same

HYNIX SEMICONDUCTOR INC2 citations62

US7417308B2Aug 26, 2008

Stack type package module and method for manufacturing the same

HYNIX SEMICONDUCTOR INC6 citations61

US7859108B2Dec 28, 2010

Flip chip package and method for manufacturing the same

HYNIX SEMICONDUCTOR INC1 citations51

HYUNDAI ELECTRONICS IND

2 patents

US6316825B1Nov 13, 2001

Chip stack package utilizing a connecting hole to improve electrical connection between leadframes

HYUNDAI ELECTRONICS IND112 citations96

US6677181B2Jan 13, 2004

Method for fabricating stacked chip package device

HYUNDAI ELECTRONICS IND16 citations91

SK HYNIX INC

2 patents

US8680652B2Mar 25, 2014

Stack package

SK HYNIX INC7 citations83

US9786590B2Oct 10, 2017

Semiconductor package including a conductive fabric

SK HYNIX INC0 citations51

KIM KI YOUNG

1 patent

US8399998B2Mar 19, 2013

Semiconductor package requiring reduced manufacturing processes

KIM KI YOUNG2 citations60

CJ CHEILJEDANG CORP

1 patent

US11773417B2Oct 3, 2023

Microalgal strains of Thraustochytrium genus, and method of producing polyunsaturated fatty acids using the same

CJ CHEILJEDANG CORP0 citations56

PARK MYUNG GEUN

1 patent

US8581397B2Nov 12, 2013

Substrate for semiconductor package with improved bumping of chip bumps and contact pads and semiconductor package having the same

PARK MYUNG GEUN4 citations55

KIM SEONG CHEOL

1 patent

US8183689B2May 22, 2012

Printed circuit board and flip chip package using the same with improved bump joint reliability

KIM SEONG CHEOL0 citations40