Inventor
CHOI SEOG-MOON
KR56 patents
⚠️ This page may combine multiple inventors who share the name “CHOI SEOG-MOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
19 patentsUS7326964B2Feb 5, 2008
Light emitting diode package with protective function against electrostatic discharge
SAMSUNG ELECTRO MECH72 citations97
US7566912B2Jul 28, 2009
Light emitting diode package
SAMSUNG ELECTRO MECH21 citations93
US7582496B2Sep 1, 2009
LED package using Si substrate and fabricating method thereof
SAMSUNG ELECTRO MECH19 citations92
US7547923B2Jun 16, 2009
Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
SAMSUNG ELECTRO MECH33 citations92
US7453093B2Nov 18, 2008
LED package and fabricating method thereof
SAMSUNG ELECTRO MECH28 citations92
US7268014B2Sep 11, 2007
Fabrication method of light emitting diode package
SAMSUNG ELECTRO MECH49 citations92
US7262440B2Aug 28, 2007
Light emitting diode package and fabrication method thereof
SAMSUNG ELECTRO MECH25 citations92
US7642656B2Jan 5, 2010
Semiconductor package and method for manufacturing thereof
SAMSUNG ELECTRO MECH15 citations90
US7649208B2Jan 19, 2010
Light emitting diode package including monitoring photodiode
SAMSUNG ELECTRO MECH19 citations84
US7371603B2May 13, 2008
Method of fabricating light emitting diode package
SAMSUNG ELECTRO MECH14 citations84
US7875497B2Jan 25, 2011
Method of manufacturing a semiconductor package
SAMSUNG ELECTRO MECH6 citations73
US7875983B2Jan 25, 2011
Semiconductor package
SAMSUNG ELECTRO MECH6 citations73
US7491978B2Feb 17, 2009
Light emitting diode package
SAMSUNG ELECTRO MECH7 citations68
US7696525B2Apr 13, 2010
Surface mounting device-type light emitting diode
SAMSUNG ELECTRO MECH6 citations63
US7911043B2Mar 22, 2011
Wafer level device package with sealing line having electroconductive pattern and method of packaging the same
SAMSUNG ELECTRO MECH2 citations62
US12025692B2Jul 2, 2024
Sensing device
SAMSUNG ELECTRO MECH0 citations60
US10992033B1Apr 27, 2021
Antenna apparatus
SAMSUNG ELECTRO MECH0 citations59
US9318352B2Apr 19, 2016
Power module package and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US7998879B2Aug 16, 2011
Insulation structure for high temperature conditions and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations52
SAMSUNG LED CO LTD
5 patentsUS7816156B2Oct 19, 2010
Light emitting diode package and fabrication method thereof
SAMSUNG LED CO LTD19 citations92
US8030762B2Oct 4, 2011
Light emitting diode package having anodized insulation layer and fabrication method therefor
SAMSUNG LED CO LTD8 citations84
US8012778B2Sep 6, 2011
LED package and fabricating method thereof
SAMSUNG LED CO LTD5 citations73
US8047693B2Nov 1, 2011
Cooling device for light emitting device package of vibration generating machine and head lamp for vibration generating machine
SAMSUNG LED CO LTD0 citations52
US7960806B2Jun 14, 2011
Sub-mount, light emitting diode package and manufacturing method thereof
SAMSUNG LED CO LTD1 citations52
LEE YOUNG KI
4 patentsUS8299692B2Oct 30, 2012
Light emitting device package and method of manufacturing the same
LEE YOUNG KI5 citations73
US8058781B2Nov 15, 2011
Anodized metal substrate module
LEE YOUNG KI4 citations63
US9231167B2Jan 5, 2016
Insulation structure for high temperature conditions and manufacturing method thereof
LEE YOUNG KI0 citations52
US8304279B2Nov 6, 2012
Light emitting diode package having anodized insulation layer and fabrication method therefor
LEE YOUNG KI0 citations52
KIM KWANG SOO
3 patentsUS8941220B2Jan 27, 2015
Power module package and system module having the same
KIM KWANG SOO4 citations73
US8729683B2May 20, 2014
Power module package and method for fabricating the same
KIM KWANG SOO0 citations52
US8502374B2Aug 6, 2013
Power module package and method for manufacturing the same
KIM KWANG SOO0 citations52
SHIN SANG HYUN
3 patentsUS8586128B2Nov 19, 2013
Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
SHIN SANG HYUN4 citations63
US8610146B2Dec 17, 2013
Light emitting diode package and method of manufacturing the same
SHIN SANG HYUN0 citations52
US8476090B2Jul 2, 2013
Method forming a semiconductor light emitting device with perforations formed within
SHIN SANG HYUN0 citations52
KIM JONG MAN
2 patentsKIM TAE HOON
2 patentsSAMSUNG ELECTRO & MDASH MECHANICS CO LTD
1 patentKANG JUNG EUN
1 patentCHUNG YUL-KYO
1 patentLIM CHANG HYUN
1 patentPARK JI HYUN
1 patentKIM TAE HYUN
1 patentKIM JIN SU
1 patentSOHN YOUNG HO
1 patentPARK HO JOON
1 patentGAO SHAN
1 patentSHIN HYE SOOK
1 patentSAMSUNG ELECTRONICS CO LTD
1 patentShowing the top 50 of 56 patents by PatentIndex Score.