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Inventor
JANG BUM-SIK
KR
7 patents
⚠️ This page may combine multiple inventors who share the name “JANG BUM-SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
3 patents
US7875497B2
Jan 25, 2011
Method of manufacturing a semiconductor package
SAMSUNG ELECTRO MECH
6 citations
73
US7875983B2
Jan 25, 2011
Semiconductor package
SAMSUNG ELECTRO MECH
6 citations
73
US9161479B2
Oct 13, 2015
Power module package and method for manufacturing the same
SAMSUNG ELECTRO MECH
0 citations
50
GAO SHAN
2 patents
US8058722B2
Nov 15, 2011
Power semiconductor module and method of manufacturing the same
GAO SHAN
4 citations
59
US8309399B2
Nov 13, 2012
Power semiconductor module and method of manufacturing the same
GAO SHAN
0 citations
48
SAMSUNG ELECTRO & MDASH MECHANICS CO LTD
1 patent
US8017437B2
Sep 13, 2011
Method for manufacturing a semiconductor package
SAMSUNG ELECTRO & MDASH MECHANICS CO LTD
45 citations
95
JANG BUM SIK
1 patent
US8575756B2
Nov 5, 2013
Power package module with low and high power chips and method for fabricating the same
JANG BUM SIK
6 citations
65