Inventor
JEONG TAE-SUNG
KR36 patents
⚠️ This page may combine multiple inventors who share the name “JEONG TAE-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS10665535B2May 26, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD17 citations93
US5095227AMar 10, 1992
MOS transistor temperature detecting circuit
SAMSUNG ELECTRONICS CO LTD24 citations92
US4988897AJan 29, 1991
TTL to CMOS input buffer circuit
SAMSUNG ELECTRONICS CO LTD24 citations92
US10580728B2Mar 3, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations73
US10431615B2Oct 1, 2019
Fan-out sensor package and camera module including the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US11189552B2Nov 30, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10438884B2Oct 8, 2019
Carrier substrate and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US10796997B2Oct 6, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11810848B2Nov 7, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11094623B2Aug 17, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US10790224B2Sep 29, 2020
Carrier substrate and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12394703B2Aug 19, 2025
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10580812B2Mar 3, 2020
Fan-out sensor package and camera module including the same
SAMSUNG ELECTRONICS CO LTD0 citations52
SAMSUNG ELECTRO MECH
13 patentsUS7642656B2Jan 5, 2010
Semiconductor package and method for manufacturing thereof
SAMSUNG ELECTRO MECH15 citations90
US10298199B2May 21, 2019
Acoustic wave device and method for manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US10048118B2Aug 14, 2018
Sensor package having a transparent covering member supported by electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations73
US7875497B2Jan 25, 2011
Method of manufacturing a semiconductor package
SAMSUNG ELECTRO MECH6 citations73
US7875983B2Jan 25, 2011
Semiconductor package
SAMSUNG ELECTRO MECH6 citations73
US10340153B2Jul 2, 2019
Fan-out semiconductor package and method of manufacturing same
SAMSUNG ELECTRO MECH6 citations72
US10340234B2Jul 2, 2019
Substrate having embedded electronic component
SAMSUNG ELECTRO MECH3 citations72
US10164602B2Dec 25, 2018
Acoustic wave device and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations71
US8351215B2Jan 8, 2013
Method of manufacturing a chip embedded printed circuit board
SAMSUNG ELECTRO MECH4 citations62
US11444043B2Sep 13, 2022
Substrate having embedded electronic component
SAMSUNG ELECTRO MECH0 citations61
US10447411B2Oct 15, 2019
Acoustic wave device and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US8871569B2Oct 28, 2014
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations52
US9673066B2Jun 6, 2017
Apparatus and method of manufacturing semiconductor package module
SAMSUNG ELECTRO MECH0 citations51