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Inventor
PRINCIPE LAURA A
US
2 patents
⚠️ This page may combine multiple inventors who share the name “PRINCIPE LAURA A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MCCONNELEE PAUL ALAN
1 patent
US8623699B2
Jan 7, 2014
Method of chip package build-up
MCCONNELEE PAUL ALAN
4 citations
70
GEN ELECTRIC
1 patent
US8829690B2
Sep 9, 2014
System of chip package build-up
GEN ELECTRIC
0 citations
49