Inventor
KUO CHIH-MING
TW33 patents
⚠️ This page may combine multiple inventors who share the name “KUO CHIH-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
13 patentsUS8347490B1Jan 8, 2013
Method for fabricating a carrier with a three dimensional inductor
CHIPBOND TECHNOLOGY CORP7 citations82
US12424551B2Sep 23, 2025
Semiconductor structure and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations61
US11651974B2May 16, 2023
Semiconductor package and method of fabricating the same
CHIPBOND TECHNOLOGY CORP1 citations61
US8513772B2Aug 20, 2013
Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof
CHIPBOND TECHNOLOGY CORP2 citations61
US8658528B2Feb 25, 2014
Bumping process and structure thereof
CHIPBOND TECHNOLOGY CORP3 citations60
US12224183B2Feb 11, 2025
Method of manufacturing semiconductor device
CHIPBOND TECHNOLOGY CORP0 citations58
US8963675B2Feb 24, 2015
Method for fabricating a carrier with a three dimensional inductor and structure thereof
CHIPBOND TECHNOLOGY CORP0 citations51
US8841767B2Sep 23, 2014
Bumping process and structure thereof
CHIPBOND TECHNOLOGY CORP0 citations51
US12543581B2Feb 3, 2026
Flip-chip bonding structure and substrate thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US9159660B2Oct 13, 2015
Semiconductor package structure and method for making the same
CHIPBOND TECHNOLOGY CORP0 citations48
US9059260B2Jun 16, 2015
Semiconductor manufacturing method and semiconductor structure thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US8823169B2Sep 2, 2014
Semiconductor manufacturing method and semiconductor structure thereof
CHIPBOND TECHNOLOGY CORP1 citations48
US8772644B2Jul 8, 2014
Carrier with three-dimensional capacitor
CHIPBOND TECHNOLOGY CORP0 citations40
KUO CHIH-MING
4 patentsUS8432017B2Apr 30, 2013
Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof
KUO CHIH-MING8 citations81
US8704345B2Apr 22, 2014
Semiconductor package and lead frame thereof
KUO CHIH-MING2 citations59
US8450049B2May 28, 2013
Process for forming an anti-oxidant metal layer on an electronic device
KUO CHIH-MING2 citations59
US8415243B1Apr 9, 2013
Bumping process and structure thereof
KUO CHIH-MING4 citations59
RITDISPLAY CORP
3 patentsUS6658762B2Dec 9, 2003
Method and apparatus for transporting substrates in OLED process
RITDISPLAY CORP9 citations72
US6957995B2Oct 25, 2005
Apparatus for repairing organic electroluminescent element defects
RITDISPLAY CORP2 citations62
US6753195B2Jun 22, 2004
Method of repairing organic light-emitting element pixels
RITDISPLAY CORP2 citations62