Inventor

CHIU YIE-CHUAN

TW4 patents

⚠️ This page may combine multiple inventors who share the name “CHIU YIE-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUO CHIH-MING

2 patents

US8450049B2May 28, 2013

Process for forming an anti-oxidant metal layer on an electronic device

KUO CHIH-MING2 citations59

US8415243B1Apr 9, 2013

Bumping process and structure thereof

KUO CHIH-MING4 citations59

WU CHIH-HUNG

1 patent

US8692390B2Apr 8, 2014

Pyramid bump structure

WU CHIH-HUNG10 citations79

CHIPBOND TECHNOLOGY CORP

1 patent

US8658528B2Feb 25, 2014

Bumping process and structure thereof

CHIPBOND TECHNOLOGY CORP3 citations60